Jiaxi Duan, Dewen Cheng, Lianbing Wang, Shuxian Sun, Qichao Hou, Yang Wang, Pengli Wang, Xin Che, Weihong Hou, Donghua Wang. Design of a Split Optical See-Through Head-Mounted Display System with Integrated Multispectral Sensors[J]. Laser & Optoelectronics Progress, 2025, 62(9): 0922002

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- Laser & Optoelectronics Progress
- Vol. 62, Issue 9, 0922002 (2025)

Fig. 1. Functional architecture diagram of OST-HMD system with integrated multi-spectral sensors

Fig. 2. Schematic diagram of split OST-HMD

Fig. 3. Schematic diagram of signal transmission architecture for head-mounted display module

Fig. 4. Frameflow of integrated multi-spectral sensors signal acquisition system

Fig. 5. Layout of OST display module system

Fig. 6. Components and prototype of the optical display module. (a) All components of the display system; (b) overall appearance of the display module

Fig. 7. Physical picture of the low-light camera module

Fig. 8. Physical picture of the infrared light camera module

Fig. 9. Physical picture of the visible light camera module

Fig. 10. Self-developed driver board circuit diagram

Fig. 11. Binocular display driver board. (a) Front layout of the driver board; (b) back layout of the driver board

Fig. 12. Handheld prototype structure of integrated multispectral signal acquisition module and freeform prism display module

Fig. 13. The prototype integrating multi-spectral signal acquisition module and display module. (a) Whole structure prototype with handheld structure and movable bracket; (b) head-mounted structure integrating multi-spectral signal acquisition module and display module

Fig. 14. Embedded core computing platform

Fig. 15. The display effect of the optical display module. (a) Input image displayed in the MicroOLED; (b) output image taken by the camera at the system output pupil

Fig. 16. Fusion of a virtual cup with a real cup. (a) Real cup; (b) fusion display of virtual cup and real cup

Fig. 17. Images captured by different sensors. (a) Image captured by low-light module; (b) image captured by infrared module; (c) image captured by visible light module
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Table 1. RK3399 chip parameter table
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Table 2. Low-light camera module specification sheet
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Table 3. Infrared light camera module specification sheet

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