• Journal of Advanced Dielectrics
  • Vol. 14, Issue 5, 2350033 (2024)
Haotian Liu, Zheng Liang, Chang Liu, Cheng Liu*, and Huaiwu Zhang**
Author Affiliations
  • School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, Sichuan 611731, P. R. China
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    DOI: 10.1142/S2010135X23500339 Cite this Article
    Haotian Liu, Zheng Liang, Chang Liu, Cheng Liu, Huaiwu Zhang. Microstructure and dielectric properties of low-temperature sintered MgO-based ceramics at millimeter wave and terahertz frequencies[J]. Journal of Advanced Dielectrics, 2024, 14(5): 2350033 Copy Citation Text show less

    Abstract

    Low-temperature co-fired ceramics (LTCC) applied in millimeter/microwave and terahertz frequencies (5G/6G) have attracted a lot of attention recently. In this study, MgO-based dielectric ceramics were successfully sintered at 950°C with the sintering aids: x wt.% of LiF fluoride (x=2, 4, 6, 8, 10) and 0.5 wt.% of BBSZ (Bi2O3–B2O3–SiO2–ZnO) glass. BBSZ glass was introduced as another sintering aid to facilitate the sintering and densification. Crystalline structure and micro-morphology were investigated and analyzed. Dielectric properties (εr, Q×f, τf) at millimeter/microwave and terahertz wave frequencies were also studied. The ionic characteristics of Mg–O bond (fi), the lattice energy (U) and the bond energy (E) were calculated and analyzed. It is suggested that the optimal x=4, where εr=10.5, Q×f=120,000 GHz (@12 GHz) and τf=?26 ppm/°C at millimeter/microwave range. When the frequency was up to terahertz (1.0 THz), the εr values were 8.8–9.35 and the tanδ were 5.6×10?3–8.7×10?3. The experimental results indicated that the low-temperature sintered MgO-based ceramics have potential for millimeter/microwave and terahertz communication applications.
    Haotian Liu, Zheng Liang, Chang Liu, Cheng Liu, Huaiwu Zhang. Microstructure and dielectric properties of low-temperature sintered MgO-based ceramics at millimeter wave and terahertz frequencies[J]. Journal of Advanced Dielectrics, 2024, 14(5): 2350033
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