To reduce the large number of stoma generated inside a conductive circuit during laser sintering, which impede further improvements in conductivity, a single factor test was conducted to study the influence of process parameters on the morphology change of a conductive circuit. Once the sintering characteristics of the conductive circuit were determined, a sintering method with variable parameters was proposed to suppress the formation of stoma. The proposed method first selects the sintering parameters that meet the requirements according to the morphological change of the conductive circuit, then determines the optimal sintering method through the single-factor test method. Finally, the stoma and microstructure of the conductive circuit sintered by the optimal method are detected and the effectiveness of the method is analyzed. The results show that laser power significantly affects the morphology of the conductive circuit; the volume of the conductive circuit shrinks during low-power sintering and expands during high-power sintering. The optimal sintering method, based on the sintering characteristics of the conductive circuit, effectively suppresses the formation of stoma, improving the conductivity by 35.6%. The results of this study, based on a sintering process that yielded a conductive circuit with fewer stoma and increased conductivity, are significant for conductive circuit performance and can confer excellent forming qualities to electronic products.