• Laser & Optoelectronics Progress
  • Vol. 51, Issue 1, 11405 (2014)
Chai Yan1、*, Ren Jun2, He Weifeng1, He Guangyu1, and Li Yuqin1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/lop51.011405 Cite this Article Set citation alerts
    Chai Yan, Ren Jun, He Weifeng, He Guangyu, Li Yuqin. Effect of Laser Shock Processing on the Fatigue Property of K4030 Alloy Blade[J]. Laser & Optoelectronics Progress, 2014, 51(1): 11405 Copy Citation Text show less
    References

    [1] Guo Jianting. Materials Science and Engineering for Superalloys(II) [M]. Beijing: Science Press, 2010,.111-114.

    [2] Li Wei, He Weifeng, Li Yinghong,et al.. Effects of laser shock processing on vibration fatigue properties of K417 material [J]. Chinese J Lasers, 2009, 36(8): 2197-2201.

    [3] He Weifeng, Li Yinghong, Zhou Zhangwen, et al.. Effects of laser shock processing on fatigue property of GH742 Ni-based superalloy [J]. Transactions of Materials and Heat Treatment, 2009, 30(3): 42-45.

    [4] Li Wei, Li Yinghong, He Weifeng, et al.. Development and application of laser shock processing [J]. Laser & Optoelectronics Progress, 2008, 45(12): 15-19.

    [5] Fairand B P, Clauer A H. Laser generation of high-amplitude stress waves in materials [J]. J Appl Phys, 1979, 50(3):1497-1502.

    [6] Richard D T, David F L. Preventing fatigue failures with laser peening [J]. The AMPTIAC Quarterly, 2003, 7(2): 3-7.

    [7] Universal Technology Corporation. High Cycle Fatigue (HCF) Science and Technology Program 2002 Annual Report[R].2003.

    [8] Michael R H, Adrian T D, Anne G D, et al.. Laser peening technology[J]. Advanced Materials & Processes, 2003, 161(8):65-71.

    [9] Yang J M, Her Y C, Clauer A H. Laser shock peening on fatigue behavior of 2024-T6 Al alloy with fastener holes and stop holes [J]. Mater Sci Eng A, 2001, 298(1-2) 296-299.

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    Chai Yan, Ren Jun, He Weifeng, He Guangyu, Li Yuqin. Effect of Laser Shock Processing on the Fatigue Property of K4030 Alloy Blade[J]. Laser & Optoelectronics Progress, 2014, 51(1): 11405
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