The new Package on Package(PoP) structure of memory is different from the conventional packages, resulting in current Destructive Physical Analysis(DPA) methods not fully applicable to the new PoP memory. In this paper, the structure and typical defects affecting the reliability of a new PoP package memory are analyzed by using 3D-X-ray, metallographic slices, stacked chip separation and internal inspection of non-top chip. A comprehensive DPA scheme with strong applicability and high efficiency is proposed, and the effectiveness of evaluating the reliability of the new PoP package memory is verified through an example. It can also provide the basis and help to the revision of subsequent standards and DPA of other advanced package devices.