Fig. 1. Overall package structure of semiconductor laser bar

Fig. 2. Nephograms of thermal stress distribution of laser dies with different solder packages and stress distributions on central axis of end face. (a) In solder, thermal stress nephogram; (b) In solder, stress distribution on central axis of end face; (c) AuSn solder, thermal stress nephogram; (d) AuSn solder, stress distribution on central axis of end face

Fig. 3. Temperature distributions of lasers with different solder packages. (a) In solder; (b) AuSn solder

Fig. 4. Spectral distributions of lasers with different solder packages. (a) In solder; (b) AuSn solder

Fig. 5. Thermal stress and temperature maximum distribution of laser dies packaged by AuSn solders with different thicknesses

Fig. 6. Thermal stress and maximum temperature distribution of laser dies packaged by WCu submount with different thicknesses

Table 1. Related material parameters