Thermal Stressin High-Power Semiconductor Laser Packaging

Qinghe Yuan; Hongqi Jing; Li Zhong; Suping Liu; Xiaoyu Ma

doi:10.3788/CJL201946.1001009

Journals >Chinese Journal of Lasers >Volume 46 >Issue 10 >Page 1001009 > Article

Chinese Journal of Lasers
Vol. 46, Issue 10, 1001009 (2019)

Thermal Stressin High-Power Semiconductor Laser Packaging

Qinghe Yuan^1、2, Hongqi Jing^1、*, Li Zhong¹, Suping Liu¹, and Xiaoyu Ma^1、2

Author Affiliations

¹National Engineering Research Center for Optoelectronic Devices, Institute of Semiconductors Chinese Academy of Sciences, Beijing 100083, China

²College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences,Beijing 100049, China

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DOI: 10.3788/CJL201946.1001009 Cite this Article Set citation alerts

Qinghe Yuan, Hongqi Jing, Li Zhong, Suping Liu, Xiaoyu Ma. Thermal Stressin High-Power Semiconductor Laser Packaging[J]. Chinese Journal of Lasers, 2019, 46(10): 1001009 Copy Citation Text

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Qinghe Yuan, Hongqi Jing, Li Zhong, Suping Liu, Xiaoyu Ma. Thermal Stressin High-Power Semiconductor Laser Packaging[J]. Chinese Journal of Lasers, 2019, 46(10): 1001009

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