• Optics and Precision Engineering
  • Vol. 16, Issue 3, 500 (2008)
1,2, 2, and 2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: Cite this Article
    [in Chinese], [in Chinese], [in Chinese]. Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist[J]. Optics and Precision Engineering, 2008, 16(3): 500 Copy Citation Text show less
    References

    [1] ZHANG J,TAN K L,GONG H Q.Characterization of the polymerization of SU-8 photoresist and its applications in micro-electro-mechanical systems(MEMS)[J].Polymer Testing,2001,20(6):693-701.

    [4] RUZZU A,MATTHIS B.Swelling of PMMA-structures in aqueous solutions and room temperature Ni-electroforruing[J].Mcirosystem Technologies,2002,8(2/3):116-119.

    [5] LIN C B,WEI M K,LIU C H,et al..Novel fabrication process for high-aspect-ratio and co-axial multi-layer nickel microstructures[C].Proceedings of the IEEE Micro Electro Mechanical Systems(MEMS),2000,584-589.

    [7] KLEIN C A.How accurate are Stoneys equation and recent modifications[J].Journal of Applied Physics,2000.88(9):5487-5489.

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    [in Chinese], [in Chinese], [in Chinese]. Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist[J]. Optics and Precision Engineering, 2008, 16(3): 500
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