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    Journals >Optics and Precision Engineering >Volume 16 >Issue 3 >Page 500 > Article
    • Optics and Precision Engineering
    • Vol. 16, Issue 3, 500 (2008)
    Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist
    1,2, 2, and 2
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  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: Cite this Article
    [in Chinese], [in Chinese], [in Chinese]. Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist[J]. Optics and Precision Engineering, 2008, 16(3): 500 Copy Citation Text show less

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    [in Chinese], [in Chinese], [in Chinese]. Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist[J]. Optics and Precision Engineering, 2008, 16(3): 500
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