[1] C WANG, N WEN, Y ZHOU G et al. Incorporation of Tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination. Applied Surface Science, 422, 738-744(2017).

[2] M GUO J, H WANG, X ZHANG C et al. MPPE/SEBS composites with low dielectric Loss for high-frequency copper clad laminates applications. Polymers, 12, 1875(2020).

[3] Y OUYANG, F DING, Y BAI L et al. Design of network Al₂O₃ spheres for significantly enhanced thermal conductivity of polymer composites. Composites Part A, 128, 105673(2020).

[4] N GOLDIN, H DODIUK, D LEWITUS. Enhanced thermal conductivity of photopolymerizable composites using surface modified hexagonal boron nitride fillers. Composites Science and Technology, 152, 36-45(2017).

[5] L REN L, L ZENG X, R SUN et al. Spray-assisted assembled spherical boron nitride as fillers for polymers with enhanced thermally conductivity. Chemical Engineering Journal, 370, 166-175(2019).

[6] L ZHANG, J ZHANG, X YUE Z et al. Thermally stable polymer-ceramic composites for microwave antenna applications. Journal of Advanced Ceramics, 5, 269-276(2016).

[7] B PONRAJ, R BHIMIREDDI, B R VARMA K. Effect of nano- and micron-sized K_0.5Na_0.5NbO₃ fillers on the dielectric and piezoelectric properties of PVDF composites. Journal of Advanced Ceramics, 5, 308-320(2016).

[8] V MENTLíK, O MICHAL. Influence of SiO₂ nanoparticles and nanofibrous filler on the dielectric properties of epoxy-based composites. Materials Letters, 223, 41-44(2018).

[9] Y OUYANG, F LI X, F DING et al. Simultaneously enhance thermal conductive property and mechanical properties of silicon rubber composites by introducing ultrafine Al₂O₃ nanospheres prepared via thermal plasma. Composites Science and Technology, 190, 108019(2020).

[10] V GUERRA, Y WAN C, T MCNALLY. Thermal conductivity of 2D nano-structured boron nitride (BN) and its composites with polymers. Progress in Materials Science, 100, 170-186(2019).

[11] Q GUO Y, Y LYU Z, T YANG X et al. Enhanced thermal conductivities and decreased thermal resistances of functionalized boron nitride/polyimide composites. Composites Part B, 164, 732-739(2019).

[12] Z LULE, J KIM. Thermally conductive and highly rigid polylactic acid (PLA) hybrid composite filled with surface treated alumina/ nano-sized aluminum nitride. Composites Part A, 124, 105506(2019).

[13] Y YANG, M GAO J, T LEI et al. Thermal conductivity and mechanical properties of polyimide composites with mixed fillers of BN flakes and SiC@SiO₂ whiskers. Polymer Engineering & Science, 60, 1044-1053(2020).

[14] Y KIM C, DANG T M LINH, Y M ZHANG et al. The alignment of AlN platelets in polymer matrix and its anisotropic thermal properties. Journal of Materiomics, 5, 679-687(2019).

[15] L WU G, Q WANG Y, K WANG K et al. The effect of modified AlN on the thermal conductivity, mechanical and thermal properties of AlN/polystyrene composites. RSC Advances, 6, 102542-102548(2016).

[16] P HE D, H GAO, J ZHANG J et al. Simulation and experimental verification of thermal property for aluminum nitrides and copper clad laminates under space thermal environment. Journal of Inorganic Materials, 34, 947-952(2019).

[17] A KOCJAN. The hydrolysis of AlN powder - a powerful tool in advanced materials engineering. The Chemical Record, 18, 1232-1246(2018).

[18] L TANG, K HE M, Y NA X et al. Functionalized glass fibers cloth/spherical BN fillers/epoxy laminated composites with excellent thermal conductivities and electrical insulation properties. Composites Communications, 16, 5-10(2019).

[19] I GANESH, M OLHERO S, J FERREIRA. Phosphoric acid treated AlN powder for aqueous processing of net-shape dense AlN and β-SiAlON parts. Advances in Applied Ceramics, 108, 111-117(2009).

[20] H HU L, K WANG Y, C WANG S. Aluminum nitride surface functionalized by polymer derived silicon oxycarbonitride ceramic for anti-hydrolysis. Journal of Alloys and Compounds, 772, 828-833(2019).

[21] W ZHANG W, C LU, N GE M et al. Surface modified and gradation-mixed Al₂O₃ as an effective filler for the polyphenylene oxide (PPO) insulative layer in copper clad laminates. Journal of Materials Science: Materials in Electronics(2020).

[22] S KUMAR R, N HAREESH U, P RAMAVATH et al. Hydrolysis control of alumina and AlN mixture for aqueous colloidal processing of aluminum oxynitride. Ceramics International, 37, 2583-2590(2011).

[23] J ZHANG, H QI S. Mechanical, thermal and dielectric properties of aluminum nitride/epoxy resin composites. Journal of Elastomers and Plastics, 47, 431-438(2015).

[24] C CHANG H, T LIN H, H LIN C et al. Facile preparation of a phosphinated bisphenol and its low water-absorption epoxy resins for halogen-free copper clad laminates. Polymer Degradation and Stability, 98, 102-108(2013).

[25] A LI, C ZHANG, F ZHANG Y. Thermal conductivity of graphene-polymer composites: mechanisms, properties, and applications. Polymers, 9, 1-17(2017).

[26] W GU J, Q GUO Y, T YANG X et al. Synergistic improvement of thermal conductivities of polyphenylene sulfide composites filled with boron nitride hybrid fillers. Composites Part A: Applied Science and Manufacturing, 95, 267-273(2017).

[27] Q WANG W, J MEYER, X ZENG Q et al. Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards. Polymers for Advanced Technologies, 27, 1577-1585(2016).

[28] Y JIN H, W WANG, Q GAO J et al. Study of machinable AlN/BN ceramic composites. Materials Letters, 60, 190-193(2006).

[29] C BIAN W, T YAO, M CHEN et al. The synergistic effects of the micro-BN and nano-Al₂O₃ in micro-nano composites on enhancing the thermal conductivity for insulating epoxy resin. Composites Science and Technology, 168, 420-428(2018).

[30] H TANG D, Q SU J, Q KONG M et al. Preparation and properties of epoxy/BN highly thermal conductive composites reinforced with SiC whisker. Polymer Composites, 37, 2611-2621(2015).

[31] R GAO, J GU A, Z LIANG G et al. Properties and origins of high-performance poly(phenylene oxide)/cyanate ester resins for high-frequency copper-clad laminates. Journal of Applied Polymer Science, 121, 1675-1684(2011).