• INFRARED
  • Vol. 43, Issue 2, 22 (2022)
Xiong XIONG, Ming-deng HU, Jian-le WU, yu DUAN, Yong-qiang ZHOU, Yu DU, and Jian-hong MAO
Author Affiliations
  • [in Chinese]
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    DOI: 10.3969/j.issn.1672-8785.2022.02.004 Cite this Article
    XIONG Xiong, HU Ming-deng, WU Jian-le, DUAN yu, ZHOU Yong-qiang, DU Yu, MAO Jian-hong. Finite Element Analysis of Thermal Stress of 2048×2048 HgCdTe Infrared Focal Plane Dewar Cold Head[J]. INFRARED, 2022, 43(2): 22 Copy Citation Text show less
    References

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    [3] Starr B, Mears L, Fulk C, et al. RVS WFIRST Sensor Chip Assembly Development Results[C]. SPIE, 2016, 9915: 99150Q.

    [4] Rogalski A. Recent Progress in Infrared Detector Technologies[J]. Infrared Physics & Technolo-gy, 2011, 54(3): 136-154.

    [5] Chen X, He K, Wang J, et al. Thermal Cycling Reliability of Indirect Hybrid HgCdTe Infrared Detectors[C]. SPIE, 2013, 8907: 890749.

    [6] Geng D, Zheng K, He Y. Fracture Analysis of InSb Focal Plane Arrays Chip under Thermal Shock[C]. SPIE, 2014, 9300: 93002I.

    [7] Zhang L, Li Y, Zhang J, et al. Numerical Analysis of Temperature and Stress Fields in Hybrid Indium Antimonide Arrays Detector with Laser Irradiation[J]. Optical and Quantum Electronics, 2019, 51(8): 1-16.

    [8] Zhang H, Lu H. Analysis of the Thermal Stress of IRFPA Assembly Using FEM[C]. SPIE, 2008, 6835: 68350J.

    [9] Zhang W T, Ye Z H, Chen X. A FEA Study on Thermal Stress of HgCdTe Infrared Focal Plane Arrays Detector[C]. SPIE, 2018, 10624: 106241X.

    XIONG Xiong, HU Ming-deng, WU Jian-le, DUAN yu, ZHOU Yong-qiang, DU Yu, MAO Jian-hong. Finite Element Analysis of Thermal Stress of 2048×2048 HgCdTe Infrared Focal Plane Dewar Cold Head[J]. INFRARED, 2022, 43(2): 22
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