Electric-field Assisted Joining Technology for the Ceramics Materials: Current Status and Development Trend

Yan LIU; Keying ZHANG; Tianyu LI; Bo ZHOU; Xuejian LIU; Zhengren HUANG

doi:10.15541/jim20220400

Journals >Journal of Inorganic Materials >Volume 38 >Issue 2 >Page 113 > Article

Journal of Inorganic Materials
Vol. 38, Issue 2, 113 (2023)

Electric-field Assisted Joining Technology for the Ceramics Materials: Current Status and Development Trend

Yan LIU^*, Keying ZHANG, Tianyu LI, Bo ZHOU..., Xuejian LIU and Zhengren HUANG|Show fewer author(s)

DOI: 10.15541/jim20220400 Cite this Article

Yan LIU, Keying ZHANG, Tianyu LI, Bo ZHOU, Xuejian LIU, Zhengren HUANG. Electric-field Assisted Joining Technology for the Ceramics Materials: Current Status and Development Trend[J]. Journal of Inorganic Materials, 2023, 38(2): 113 Copy Citation Text

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. Joining technology of ceramics and their applications^[13]

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. Equipment and mechanism of FDB ^[25-26]

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. Interfacial SEM micrographs of manganese-zinc ferrite poly- and single-crystals under different bonding conditions^[25]

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. Cross-sectional microstructures at the Ni/ZrO₂ interfaces after joining under different current intensities and polarities^[33]

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. TEM micrographs of the Al₂O₃/Ti joint bonded at 900 ℃ for 1 h under 700 V DC field ^[34]

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. Working schematic of an SPS apparatus^[38]

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. Fractured micrographs of the TaC-HfC joint ^[44]

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. Backscattered SEM images of the polished cross section of the CVD β-SiC joined with the pre-sintered Ti₃SiC₂ foil using SPS^[46]

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. Microstructures of CVD-SiC/Ti/Nb/Ti/CVD-SiC joint^[49]

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. Schematic diagram and performance of flash joining^[24]

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. Schematic diagrams of interfacial microstructure evolution of 3YSZ/Ag-CuO/430SS assembly^[69]

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. SEM images of 3YSZ joint^[24]

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. Shear strength of the 3YSZ/Ti-alloy joint under different conditions^[74]

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Joining method	Electric field type	Electric field	Joining current	Joining temperature	Joining time
FDB	DC	Small	Small	Low	Long
SPS	DC pulse	Small	Large	High	Short
FJ	DC/DC pulse	Large	Small	Low	Fast

Table 1. Comparison of three electric-field assisted joining technologies

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Joining system	Joining condition	Shear strength/MPa	Main phases at interface	Ref.
Al/β-Al₂O₃	500-600 ℃, 500 V, 1-2 h	—	No interlayer	[27]
Cu/ZrO₂	800 ℃ 50 V, 1 A, 20 min	—	Cu₂O, Cu-Zr	[32]
Ni/ZrO₂	1100 ℃, 10 mA, 30 min	160±15	Ni-Zr	[33]
Polycrystal ferrites/single crystalline ferrites	1200 ℃, 1 A, 24 h	—	No interlayer	[25]

Table 2. FDB of ionic conductive ceramics

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Joining system	Joining conditions	Joint strengthcharacterization	Maximum averagejoint strength/MPa	Ref.
SiC/SiC	1900 ℃, 5 min, 3.5 MPa	Bending strength	260.24±12.00	[20]
LR-SiC/LR-SiC	1750 ℃, ~500 ℃/min, 800 A, 10 min, 50 MPa	—	—	[39]
HR-SiC/HR-SiC	2100 ℃, 100 ℃/min, 2400 A, 10 min, 50 MPa	—	—	[39]
CVD-SiC/CVD-SiC	1900 ℃, 50 ℃/min, 5 min, 60 MPa	Bending strength	436±1	[22]
Coated C/SiC/C/SiC	1700 ℃, 150-200 ℃/min, 3 min, 60 MPa	Shear strength	24.6	[40]
Ti₃SiC₂/Ti₃AlC₂	1200 ℃, 150 ℃/min, ~1.18 kA, <6 min, 15 MPa	Shear strength	~50	[41]
Ti₃SiC₂/Ti₃SiC₂	1300 ℃, 150 ℃/min, ~1.30 kA, <6 min, 15 MPa	Shear strength	~50	[41]
Ti₃AlC₂/Ti₃AlC₂	1300 ℃, 150 ℃/min, ~1.32 kA, <6 min, 15 MPa	Shear strength	~60	[41]
SiC_w/Ti₃SiC₂/SiC_w/Ti₃SiC₂	1090 ℃, 100 ℃/min, 586 A·cm^-2, 30 s, 30 MPa	Shear strength	51.8±2.9	[42]
STO bicrystal/STO bicrystal	1200 ℃, 70-80 ℃/min, ~550 A, 15 min, 140 MPa	—	—	[43]
TaC/HfC	1850 ℃, 10 min, 60 MPa	—	—	[44]
α-SiAlON/α-SiAlON	1650 ℃, 10 min, 20 MPa	Bending strength	~610	[45]

Table 3. SPS joining of ceramic material without interlayer

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Joining system	Interlayer	Joining conditions	Joint strengthcharacterization	Maximum joint strength/MPa	Main phases at interface	Ref.
SiC/SiC	4.5YSZ	1700 ℃, 150 ℃/min, 40 MPa	Bending strength	26.7	ZrO₂	[47]
SiC/SiC	4.5YSZ+20% Al₂O₃(in mass)	1800 ℃, 100-200 ℃/min, 40 MPa	Bending strength	107.3	ZrO₂, mZrO₂	[47]
SiC/SiC	TSC	1900 ℃, 5 min, 3.5 MPa	Bending strength	230.6±19	TiC, Ti, Al	[20]
SiC/SiC	TAC	1900 ℃, 5 min, 3.5 MPa	Bending strength	230.5±13	TiC, Al, Ti	[20]
SiC/SiC	TSC	1300 ℃, 100-200 ℃/min, 15 min, 50 MPa	Bending strength	80.4	TiC_x, Ti_xSi_y	[23]
SiC/SiC	TSC	1400 ℃, 100-200 ℃/min, 30 MPa	Bending strength	66	TiSi₂, TiC	[48]
SiC/SiC	TSC	1600 ℃, 30 min, 20-40 MPa	Bending strength	110.4	TSC, TiC	[19]
CVD-SiC/CVD-SiC	TSC	1300 ℃, 100 ℃/min, 5 min, 50 MPa	Bending strength	220.3±3.2	TSC	[46]
Coated SiC_f/SiC/coated SiC_f/SiC	TSC	1300 ℃, 100 ℃/min, 5 min, 50 MPa	Shear strength	18.3±5.8	TSC	[21]
Coated C_f/SiC/coated C_f/SiC	TSC	1300 ℃, 100 ℃/min, 5 min, 50 MPa	Shear strength	31.1±4.0	TSC	[21]
Uncoated T300 1K C_f/SiC/uncoated T300 1K C_f/SiC	TSC	1300 ℃, 100 ℃/min, 5 min, 50 MPa	Shear strength	19.1±2.0	TSC, SiC	[21]
Uncoated M40J 3K C_f/SiC/uncoated M40J 3K C_f/SiC	TSC	1300 ℃, 100 ℃/min, 5 min, 50 MPa	Shear strength	5.5±1.8	TSC, SiC	[21]
Coated C/SiC/coated C/SiC	CA	1480 ℃, 50 ℃/min, 10 min, 0 MPa	Shear strength	~14.1	CA	[40]
Coated C/SiC/coated C/SiC	SiC+B₄C	1900 ℃, 150-200 ℃/min, 3 min, 60 MPa	Shear strength	18.2	—	[40]
C_f/SiC/C_f/SiC	TSC	1600 ℃, 30 min, 20-40 MPa	Bending strength	62.6	TSC, TiC	[19]

Table 4. SPS joining of ceramic material with inorganic material interlayer

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Joining system	Interlayer	Joining conditions	Joint strengthcharacterization	Maximum joint strength/MPa	Main phases at interface	Ref.
SiC/SiC	Y	1900 ℃, 100 ℃/min, 10 min, 50 MPa	Bending strength	134.8±2.1	ZrO₂	[50]
SiC/SiC	Ti	1000 ℃, 100 ℃/min, 5 min, 30 MPa	Bending strength	205.7±24	ZrO₂, mZrO₂	[51]
SiC/SiC	3Ti/1.2Si/2C/0.2Al	1600 ℃, 100-200 ℃/min, 30 MPa	Bending strength	133	TiC, Ti, Al	[48]
SiC coated C/SiC/ SiC coated C/SiC	Ti/Nb/Ti	1200 ℃, 100 ℃/min, 5 min, 50 MPa	Shear strength	61±6	TiC, Al, Ti	[49]
CVD-SiC/CVD-SiC	Ti	1700 ℃, 50 ℃/min, 5 min, 60 MPa	Bending strength	126±16	TiC_x, Ti_xSi_y	[22]
Coated C/SiC/coated C/SiC	Ti	1700 ℃, 150-200 ℃/min, 3 min, 60 MPa	Shear strength	17.3±7.8	TiSi₂, TiC	[40]

Table 5. SPS joining of ceramic material with metal interlayer

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Joining system	Joining conditions	Joint strengthcharacterization	Maximum averagejoint strength/MPa	Ref.
3YSZ/3YSZ	900 ℃, 30 V/cm, 100 mA/mm², 6 MPa, 1 s	Bending strength	595	[24]
CVD-SiC/Ti/C_f/SiC	1250 ℃, 2.2 kW, 370 A, 16 MPa, 7 s	Shear strength	31.4	[65]
3YSZ/3YSZ	800 ℃, 50 V/cm, 100 mA/mm², 6 MPa, 18 s	Bending strength	606±18	[70]
MgO-doped Al₂O₃/MgO-doped Al₂O₃	1300 ℃, 1500 V/cm, 0.1 A, 4 MPa, 30 s	Shear strength	146	[71]
BSCF/BSCF	1000 ℃, 10 V/cm, 0.45 A/mm², 10 s	—	—	[72]
ZrO₂/ZA/Al₂O₃	1200 ℃, 1800 V/cm, 0.3 A, 4 MPa, 30 s	Shear strength	3YSZ/ZA: ~65ZA/Al₂O₃: ~30	[73]

Table 6. Flash joining between ceramics

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Joining system	Joining conditions	Joint strengthcharacterization	Maximum joint strength/MPa	Main phases at interface	Ref.
ZrO₂/Ti-alloy	700 ℃, 100 V/cm, 70 mA/mm², 30 s,10 MPa	Shear strength	67±9	Ti, Zr	[74]
ZrO₂/Ni-alloy	800 ℃, 100 V/cm, 100 mA/mm², 1 s, 5 MPa	Shear strength	133	Ni, Zr	[75]
3YSZ/Ag-CuO/430SS	950 ℃, 80 V/cm, 40 mA/mm², 30 s, 0.7 MPa	Shear strength	158±9	AgCu₄Zr	[69]
3YSZ/Cu/304SS	1200 ℃, 50 V/cm, 100 mA/mm², 30 s, 6 MPa	Shear strength	21±4	Cu-Zr	[76]
3YSZ/Cu/GH3128	1000 ℃, 30 mA/mm², 30 s, 0.1 MPa	Shear strength	250±15	Cu-Zr	[77]

Table 7. Flash joining between ceramics and metals

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