Xiao Zhang, Kai Liu, Mingdi Wang, Yüji Ni, Yü Pan, Jincong Liu, Chao Ni, Wenjie Zhang. Etching Technology for Copper-Clad Laminates Based on Femtosecond Laser[J]. Acta Optica Sinica, 2019, 39(12): 1214003
- Acta Optica Sinica
- Vol. 39, Issue 12, 1214003 (2019)
Fig. 1. Ultra depth of field measurement results of FPC copper-clad laminate
Fig. 2. Experimental scheme
Fig. 3. FPC copper etching model and scanning path
Fig. 4. Relationship among femtosecond laser power, depth, and roughness at the etched area of copper layer
Fig. 5. Relationship among femtosecond laser frequency, depth, and roughness in the etched area of copper layer
Fig. 6. Relationship among scanning speed of femtosecond laser, depth, and roughness in the etched area of copper layer
Fig. 7. Relationship among femtosecond laser scanning times, depth, and roughness in the etched area of the copper layer
Fig. 8. Relationship among femtosecond laser defocusing amount, depth, and roughness in the etched area of copper layer
Fig. 9. Measurement results of 3D laser microscope. (a) Etching window; (b) 3D morphology
Fig. 10. EDS measurement results of etched area. (a) Micro morphology of etched area; (b) EDS spectrum
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Table 1. Process parameters and experimental results of FPC copper laminate etched by femtosecond laser
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Table 2. Factor level table
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Table 3. Element arrangement and results of orthogonal test
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Table 4. Range analysis
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Table 5. Atomic number fraction of each element
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