• Acta Photonica Sinica
  • Vol. 34, Issue 5, 737 (2005)
[in Chinese]1, [in Chinese]1, [in Chinese]1, [in Chinese]1, and [in Chinese]2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • show less
    DOI: Cite this Article
    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Microregion Deformation Measurement of Thin Films Using Array Microindentation Mark Method[J]. Acta Photonica Sinica, 2005, 34(5): 737 Copy Citation Text show less
    References

    [1] Michel B, Vogel D.Micro and nanoDAC-A powerful technique for nondestructive microcrack evaluation.Proc of SPIE, 2002, 4703: 194~198

    [2] Osten W, Jueptner W, Seebacher S,et al.Qualification of optical measurement techniques for the investigation of material parameters of microcomponents.Proc of SPIE, 1999, 3825:152~164

    [3] Xing Y M, Dai F L, Yang W. An experimental study about nano-deformation field near quasi-cleavage crack tip.Science in China (A), 2000, 43(9): 963~968

    [4] Meurs P F M, Schreurs P J G, Peijs T,et al.Characterization of interphase conditions in composite materials.Composites-Part A: Applied Science and Manufacturing, 1996,27(9): 781~786

    [5] Parks V J.Strain measurement using grids.Opt Eng, 1982,21(4): 633~639

    [6] Goldrein H T, Palmer S J P, Huntley J M.Automated fine grid technique for measurement of large-strain deformation maps.Optics and Lasers in Engineering, 1995,23(5): 305~318

    [7] Corleto C R, Bradley W L, Brinson H F.An experimental micromechanics measurement technique for submicrometre domains. Journal of Materials Science, 1996, 31(7):1803~1808

    [8] Nix W D, Gao H. Indentation size effects in crystalline materials. J Mech Phys Solids, 1998,46(3): 411~425

    [9] Li X, Yang Y, Wei C.In-situ and real-time tensile testing of thin films using double-field-of-view electronic speckle pattern interferometry measurement science and technology. Measurement Science and Technology, 2004, 15(1): 75~83

    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Microregion Deformation Measurement of Thin Films Using Array Microindentation Mark Method[J]. Acta Photonica Sinica, 2005, 34(5): 737
    Download Citation