• High Power Laser and Particle Beams
  • Vol. 34, Issue 6, 063004 (2022)
Yan Luo, Lei Ding, Yi Zhao, Chongbin Yao, and Lichun Wang
Author Affiliations
  • Shanghai Aerospace Electronic and Communication Equipment Research Institute, Shanghai 201109, China
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    DOI: 10.11884/HPLPB202234.210360 Cite this Article
    Yan Luo, Lei Ding, Yi Zhao, Chongbin Yao, Lichun Wang. Optimization design and simulation of electric field at interface between substrate and electrode of photoconductive switch[J]. High Power Laser and Particle Beams, 2022, 34(6): 063004 Copy Citation Text show less
    Photoconductive switch with opposite electrodes
    Fig. 1. Photoconductive switch with opposite electrodes
    Dielectric ring electrode package structure
    Fig. 2. Dielectric ring electrode package structure
    Diagram of device model
    Fig. 3. Diagram of device model
    Electric field intensity distribution
    Fig. 4. Electric field intensity distribution
    Electric field intensity of different cylindrical electrode structures
    Fig. 5. Electric field intensity of different cylindrical electrode structures
    Electric field intensity distribution
    Fig. 6. Electric field intensity distribution
    Electric field intensity distribution with solder interface
    Fig. 7. Electric field intensity distribution with solder interface
    Maximum electric field intensity under different solder thickness
    Fig. 8. Maximum electric field intensity under different solder thickness
    Electric field distribution of dielectric constant 30 of insulating medium
    Fig. 9. Electric field distribution of dielectric constant 30 of insulating medium
    Static high voltage test
    Fig. 10. Static high voltage test
    materialdielectric strength/(kV·mm−1) dielectric constantthermal conductivity/(W·m−1·K−1) CTE/(K−1)
    CVD diamond10005.71000~20001.1×10−6
    fused silica25~403.751.30.55×10−6
    undoped SiC30010300~5004.0×10−6
    AlN179140~1804.5×10−6
    epoxy glue20~403.8~6.21.1(20~60)×10−6
    Al2O316.99.8358.4×10−6
    silicone30~402.5~41.2300×10−6
    ZrO29292.210.3×10−6
    Table 1. Insulation material performance
    materialdielectric constantmaximum electric field /(kV·mm−1)
    thickness of the solder is 0.03 mmthickness of the solder is 0.02 mm
    CVD diamond5.739.736.8
    Al2O3937.132.1
    undoped SiC、AlN1034.427.6
    CdWO412.832.328.9
    MnWO41530.427.3
    ZnWO417.627.726.1
    CoNb2O62027.225.7
    Ba5Ta4O152624.024.1
    ZrO23024.822.0
    ZrO23224.223.5
    Table 2. Maximum electric field intensity of different dielectric constant insulation rings
    Yan Luo, Lei Ding, Yi Zhao, Chongbin Yao, Lichun Wang. Optimization design and simulation of electric field at interface between substrate and electrode of photoconductive switch[J]. High Power Laser and Particle Beams, 2022, 34(6): 063004
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