NOVEL THERMAL CYCLE SCREENING EQUIPMENT FOR CRYOGENIC SEMICONDUCTOR COMPONENTS WU Li-Gang LIU Da-Fu ZHU San-Gen WU Jia-Rong HONG Si-Min GONG Hai-Mei

[in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]

Journals >Journal of Infrared and Millimeter Waves >Volume 25 >Issue 2 >Page 153 > Article

Journal of Infrared and Millimeter Waves
Vol. 25, Issue 2, 153 (2006)

NOVEL THERMAL CYCLE SCREENING EQUIPMENT FOR CRYOGENIC SEMICONDUCTOR COMPONENTS WU Li-Gang LIU Da-Fu ZHU San-Gen WU Jia-Rong HONG Si-Min GONG Hai-Mei

[in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], and [in Chinese]

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[in Chinese]

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DOI: Cite this Article

[in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. NOVEL THERMAL CYCLE SCREENING EQUIPMENT FOR CRYOGENIC SEMICONDUCTOR COMPONENTS WU Li-Gang LIU Da-Fu ZHU San-Gen WU Jia-Rong HONG Si-Min GONG Hai-Mei[J]. Journal of Infrared and Millimeter Waves, 2006, 25(2): 153 Copy Citation Text

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References

[2] YAN Qi,Rex Lam,et al.Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints[ J ].Microelectronics Reliability,2006,46 (2-4):574-588.

[3] Ikuo Shohji,Hideo Mori,et al.Solder joint reliability evaluation of chip package using a modified Coffin-Manson equation [ J ].Microelectronics Reliability,2005,44 (2):269-274

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[1] Cao Lan, Deng Ruohan, Gong Haimei. Automated vacuum system for lifetime test of IR detectors[J]. Infrared and Laser Engineering, 2015, 44(6): 1712

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