• Chinese Journal of Lasers
  • Vol. 51, Issue 7, 0701017 (2024)
Peng Fu1, Yanchun Zhang2, Tao Zhao1、*, Yongming Zhao2, Song Tang2, Ying Li2, and Shendan Han1
Author Affiliations
  • 1Guangdong Advanced Technology Institute Co., Ltd., Guangzhou 510535, Guangdong , China
  • 2Dogain Optoelectronic Technology (Suzhou) Co., Ltd., Suzhou 215124, Jiangsu , China
  • show less
    DOI: 10.3788/CJL230896 Cite this Article Set citation alerts
    Peng Fu, Yanchun Zhang, Tao Zhao, Yongming Zhao, Song Tang, Ying Li, Shendan Han. Design and Fabrication of High‑Efficiency and High‑Power 976 nm Semiconductor Laser Chips[J]. Chinese Journal of Lasers, 2024, 51(7): 0701017 Copy Citation Text show less
    Calculation and simulation results of refractive index and light field distribution of epitaxial structure
    Fig. 1. Calculation and simulation results of refractive index and light field distribution of epitaxial structure
    Calculated vertical far-field distribution
    Fig. 2. Calculated vertical far-field distribution
    Influence of reflectivity of anti-reflection film on laser performance parameters at different chip cavity lengths. (a) PCE; (b) threshold current; (c) slope efficiency
    Fig. 3. Influence of reflectivity of anti-reflection film on laser performance parameters at different chip cavity lengths. (a) PCE; (b) threshold current; (c) slope efficiency
    Measured optical power and PCE versus operating current for COS before optimization
    Fig. 4. Measured optical power and PCE versus operating current for COS before optimization
    Measured optical power and PCE versus operating current for COS after optimization
    Fig. 5. Measured optical power and PCE versus operating current for COS after optimization
    Power and voltage of device versus current before and after optimization
    Fig. 6. Power and voltage of device versus current before and after optimization
    Measured far-field distributions of COS when operating current is 23 A
    Fig. 7. Measured far-field distributions of COS when operating current is 23 A
    Energy ratios under different slow-axis far-field divergence angles at 23 A current
    Fig. 8. Energy ratios under different slow-axis far-field divergence angles at 23 A current
    Measured spectrum at 23 A current
    Fig. 9. Measured spectrum at 23 A current
    Power record curves in accelerated lifetime test
    Fig. 10. Power record curves in accelerated lifetime test
    RegionMaterialThickness /μmDoping concentration /cm-3
    P-capGaAs0.14×1019 for C
    P-claddingAl0.48Ga0.52As1.22×1018 for C
    P-waveguideAl0.18Ga0.82As0.55
    Active regionInGaAs/AlGaAs0.1
    N-waveguideAl0.18Ga0.82As0.55
    N-waveguideAl0.18Ga0.82As0.61×1017 for Si
    N-claddingAl0.22Ga0.78As1.801×1018 for Si
    N-bufferGaAs0.72×1019 for Si
    Table 1. Main material parameters of 976 nm epitaxial wafer
    Peng Fu, Yanchun Zhang, Tao Zhao, Yongming Zhao, Song Tang, Ying Li, Shendan Han. Design and Fabrication of High‑Efficiency and High‑Power 976 nm Semiconductor Laser Chips[J]. Chinese Journal of Lasers, 2024, 51(7): 0701017
    Download Citation