Lei QIAN, Jie HU, Yameng SHAN, Junduo WANG, Peng ZHOU, Wenjiang SHEN. Novel Packaging Stress Isolation Structure for MEMS Micromirror with Piezoresistive Angle Sensor[J]. Acta Photonica Sinica, 2022, 51(5): 0551311
- Acta Photonica Sinica
- Vol. 51, Issue 5, 0551311 (2022)
Fig. 1. View of MEMS biomaterial assembly
Fig. 2. The calculated displacement of chip deformation
Fig. 3. Piezoresistor coordinate and integration path
Fig. 4. View of packaging of MEMS micromirror and micromirror in details
Fig. 5. Fabrication process of the proposed micromirror
Fig. 6. Photographs of the fabricated MEMS mirror chip
Fig. 7. Test setup
Fig. 8. Output of piezoresistive angle sensor
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