Excimer laser machining technology is based on photochemical mechanism. Excimer laser has the characteristics of short wavelength, high repetition rate, high single pulse energy, large output spot and uniform energy distribution. It has unique advantages in the field of precision and high efficiency microprocessing. Excimer laser micromachining can reduce the heat affected zone (HAZ) and effectively avoid cracks and other defects. It has a promising application prospect in the field of fine machining of materials. Research progress of excimer laser micromachining, and the application of excimer laser micromachining in the field of microelectronics integrated circuit packaging, micro-electro-mechanical system (MEMS) material processing and biological medicine are introduced. The development trend of excimer laser micromachining technology is summarized.