The properties of Huntsman SL7510 type photosensitive resin were investigated by using a FT-IR spectrometer, a stereolithography apparatus, a spinning viscometer, a universal testing machine and a thermomechanical analysis meter. The experimental results showed that the photosensitive resin belongs to an epoxy-acrylic hybrid photosensitive resin, its viscosity at 30 ℃ is 335 mPa·s, its critical exposure (Ec) is 10.9 mJ/cm2, its penetration depth (Dp) is 0.14 mm, its cured volumetric shrinkage is 4.03%, the tensile strength of its cured product is 40.8 MPa, the tensile modulus of its cured product is 2009.2 MPa, the elongation at break of its cured product is 13.6%, and the glass transition temperature of its cured product is 62 ℃. According to the determined Ec and Dp values of the photosensitive resin, the processing parameters of the stereolithography apparatus were chosen to fabricate the part of a telephone shell, and the quality of the fabricated part was good.