Non-contact thickness measurement for ultra-thin metal foils with differential white light interferometry

Yanli Du; Huimin Yan; Yong Wu; Xiaoqiang Yao; Yongjun Nie; Baixuan Shi

[1] S. Terada, H. Murakami, and K. Nishihagi, in Proceedings of IEEE/SEMI Advanced Semiconductor Manufacturing Conference 125 (2001).

[2] J. M. De Freitas, J. S. Barton, J. D. C. Jones, A. C. Jones, M. Millington, G. Gregory, P. Spencer, I. Bain, and S. Cresswell, Proc. SPIE 4076, 152 (2000).

[3] F. Sakran, M. Golosovsky, H. Goldberger, D. Davidov, and A. Frenkel, Appl. Phys. Lett. 78, 1634 (2001).

[4] G.-H. Kim and S.-W. Kim, Proc. SPIE 3783, 239 (1999).

[5] D. K. Nayak, L. Wang, and R. Rakkhit, in IEEE Integrated Reliability Workshop, Final Report, International 160 (1996).

[6] J. Pei, F. L. Degertekin, and B. T. Khuri-Yakub, Appl. Phys. Lett. 66, 2177 (1995).

[7] I. Leizerson and S. G. Lipson, Appl. Phys. Lett. 83, 260 (2003).

[8] M. Procop, M. Radtke, M. Krumrey, K. Hasche, S. Schadlich, and W. Frank, Anal. Bioanal. Chem. 374, 631 (2002).

[9] Y. J. Rao and D. A. Jackson, Meas. Sci. Technol. 7, 981 (1996).

[10] B. Qi, G. R. Pickrell, J. C. Xu, P. Zhang, Y. H. Duan, W. Peng, Z. Y. Huang, W. Huo, H. Xiao, R. G. May, and A. Wang, Opt. Eng. 42, 3165 (2003).