Research in the Heat Sensitivity of Thermal Resistance of High Power LED Devices

Yang Weiqiao; Zhang Jianhua; Yin Luqiao

doi:10.3788/lop52.012302

[1] Paasschens Jcj, Harmsma S, Van der Toom R. Dependence of thermal resistance on substrate and actual temperature[C]. Proceedings of the 2004 Bipolar/BiCMOS Circuits and Technology Meeting, Montreal, Canada. 2004. 96-99.

[2] Mao Defeng, Guo Weilin, Gao Guo, et al.. Research on the thermal resistance and junction temperature of high-power LEDs[J]. Research& Progress of Solid State Electronics, 2010, 30(2): 308-312.

[3] Liew Weiching, Ong Chaoyui, Devarajan Mutharasu. Thermal analysis of high power LEDs at different drive-in current[C]. 2nd Asia Symposium on Quality Electronic Design, Penang, Malaysica, 2010. 70-75.

[4] Lee Szeyen, Mutharasu Devarajan. Thermal analysis of multi- chip LED package with different position and substrate temperatures[C]. 2011 IEEE 2nd International Conference on Photonics, Kota Kinabalu, Malaysia, 2011. 1-4.

[5] Yu Binhai, Wang Yaohao. Junction temperature and thermal resistance affect the development of HP-LED[J]. Chinese Journal of Luminescence, 2005, 26(6): 761-766.

[6] Chen Liucaroline, Lehtiniemi Reijo, Vandevelde Bart, et al.. Steady state and transient thermal characterization for flip chip interconnection on flexible substrate[C]. 7th Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italia, 2006. 1-6.

[7] Zhuang Peng. Thermal resistance measurement and structure identification for high-power LED[J]. Advanced Display,2008, (9): 25-29.

[8] Kotchetkov D, Zou J, Balandin Aa, et al.. Effect of dislocations on thermal conductivity of CaN layers[J]. Applied Phys-ics Letters, 2001, 79(26): 4316-4318.

[9] Christensen Adam, Nicol David, Ferguson Lan, et al.. Thermal design considerations in the packaging of GaN based light emitting diodes[C]. Fifth International Conference on Solid State Lighting, Denver, Colorado, 2005. 1-14.

[10] Singal Bemards. Factors affecting semiconductor device thermal resistance measurements[C]. Fourth Annual Semicon-ductor Thermal and Temperature Measurement Symposium, San Diego, 1988. 12-18.