Fig. 1. Variation of electron temperature with time (a) and lattice temperature with time (b) under subpicosecond laser irradiation with energy density of 0.25, 0.28, 0.30, 0.35, 0.40 J/cm2 and pulse width of 430 fs; Variation of electron temperature with time (c) and lattice temperature with time (d) under picosecond laser irradiation with energy density of 0.20, 0.30, 0.38, 0.41, 0.42 J/cm2 of 8 ps
Fig. 2. Variation of electron temperature with time under laser irradiation with pulse width of 430, 700, 1000, 1200, 1500 fs and energy density of 0.35 J/cm2
Fig. 3. Variation of real and imaginary parts of dielectric constant with time under the action of pulse width of 8 ps and pulse energy density of 0.28 J/cm2
Fig. 4. Under laser irradiation with pulse width of 430 fs and 8 ps respectively, (a) change of peak carrier number density and the real part of peak dielectric constant on monocrystalline silicon surface with the change of incident laser energy density; (b) Change of peak refractive index and peak extinction coefficient on monocrystalline silicon surface with the change of incident laser energy density
Fig. 5. Changes of refractive index and extinction coefficient of silicon surface with pulse width when energy density is 0.28 J /cm2 and 0.31 J /cm2, respectively
Quantity | Symbol | Value | Electron-hole pair heat conductivity[16] | KC/W·(m·K)−1 | 7.1×10−3TC−0.5552 | Lattice heat conductivity[16] | KL/W·(m·K)−1 | 1.585×105TL−1.23 | Carrier heat conductivity[16] | CC/J·(m3·K)−1 | 3NkB | Lattice heat capacity[16] | CL/J·(m3·K)−1 | 1.978×106+354TL−3.68×106/TL2 | Auger recombination coefficient[16] | γ/m6·s−1 | 3.8×10−43 | Ambipolar diffusion coefficient | D/m2·s−1 | (300×1.8×10−3)/TL | Impact ionization coefficient[16] | θ/s−1 | 3.6×1010exp(−1.5Eg/(kBTC))
| Effective electron mass[14] | m*/kg
| 9.1×10−31(0.15+3.1×10−5TC)
| Energy relaxation time[16] | τe/s
| 0.5×10−12{1+[N/(2×1027)]2}
| Interband absorption (532 nm)[17] | α/m−1 | 5.02×105exp(TL/430)
| Two-photon absorption (532 nm)[18] | β/s·m·J−1 | 0 | Free-carrier absorption cross section (532 nm)[19] | Θ/m2 | 0 | Interband absorption (800 nm)[16] | α/m−1 | 1.12×105exp(TL/430)
| Two-photon absorption (800 nm)[16] | β/s·m·J−1 | 9×10−11 | Free-carrier absorption cross section (800 nm)[16] | Θ/m2 | 2.9×10−22(TL/300)
| Latent heat of melting[16] | Lm /J·m−2 | 4206×106 | Latent heat of evaporation[16] | Lv /J·m−2 | 32020×106 | Electron heat capacity[16] | Ce/J·(m3·K)−1 | 100Te | Lattice heat capacity[16] | Cl/J·(m3·K)−1 | 1.06×106×(3.005−2.629×10−4Tl)
| Electron heat conductivity[16] | Ke/W·(m·K)−1 | 67 |
|
Table 1. Model parameters of monocrystalline silicon