Bangjie Hu, Qinghua Zhang, Mincai Liu, Qiao Xu, Yaguo Li. Simulation Study on Behavior Characteristics of Ion-Beam Sputtering to Fused Silica, Silicon, Gold, and Copper Using Monte Carlo Method[J]. Laser & Optoelectronics Progress, 2023, 60(7): 0716001
- Laser & Optoelectronics Progress
- Vol. 60, Issue 7, 0716001 (2023)
Fig. 1. Diagram of collision cascade classification. (a) Single collision regime; (b) linear collision process; (c) nonlinear collision process
Fig. 2. Flow chart of program algorithm for linear collision theory
Fig. 3. Distribution of sputtering yield under different energies and incident angles. (a) 0°; (b) 45°; (c) 85°
Fig. 4. Distribution of sputtering yield under different incident angles
Fig. 5. Change of damage depth under different energies and incident angles. (a) 0°; (b) 45°; (c) 85°
Fig. 6. Impact region of collision cascade at different incident angles
Fig. 7. Longitudinal distribution of damage density
Fig. 8. Longitudinal distributions of energy loss of different ions. (a) He+; (b) Ne+; (c) Ar+
Fig. 9. Effect of Ar ion on sputtering of Si/SiO2/Cu/Au. (a) Sputtering yield; (b) damage depth
Fig. 10. Effect of Ga ion on sputtering of Si/SiO2/Cu/Au. (a) Sputtering yield; (b) damage depth
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Table 1. Parameters of sputtering condition for incident ions
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Table 2. Parameters of material model
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Table 3. Concept of target damage parameter
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