• Microelectronics
  • Vol. 52, Issue 3, 510 (2022)
JIANG Kai, ZHU Hongjiao, LI Jing long, WANG Xuguang, and TAN Kankan
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  • [in Chinese]
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    DOI: 10.13911/j.cnki.1004-3365.210478 Cite this Article
    JIANG Kai, ZHU Hongjiao, LI Jing long, WANG Xuguang, TAN Kankan. Study on the Au-Si Diffusion Mechanism in AuSn Alloy Welding Process of Silicon-Based Chips[J]. Microelectronics, 2022, 52(3): 510 Copy Citation Text show less
    References

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    [2] TOLLEFSEN T A, LARSSON A,LOVVIK O M,et al. Au-Sn SLID bonding-properties and possibilities [J]. Metallurgical and Materials Trans B, 2012, 43B:397-405.

    [10] HIRAKI A. low temperature reactions at Si-metal contacts -from SiO2 growth due to Si-Au reaction to the mechanism of silicide formation [J]. Jpn J Appl Phys, 1983, 22(4): 549-562.

    [11] COFFA S,JACOBSON D C,POATE J M, et al. Mechanisms of ion-beam-enhanced diffusion in amorphous silicon [J]. Appl Phys A, 1992, 54(6):481-484.

    [12] MONSON T K, VECHTEN J V,GRAUPNER R K. Comment on "Gold, self-, and dopant diffusion in silicon" [J]. Phys Rev B Conden Matter, 1994, 49(4): 2972-2976.

    [13] COFFA S,PRIVITERA V,FRISINA F,et al. Three‐dimensional concentration profiles of hybrid diffusers in crystalline silicon [J]. J Appl Phys, 1993, 74(1): 195-200.

    JIANG Kai, ZHU Hongjiao, LI Jing long, WANG Xuguang, TAN Kankan. Study on the Au-Si Diffusion Mechanism in AuSn Alloy Welding Process of Silicon-Based Chips[J]. Microelectronics, 2022, 52(3): 510
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