During satellite's working， HgCdTe mid or long wavelength infrared (IR) detectors cooled by the stirling cooler are subjected to thousands of repeated thermal cycles from below -173℃ to room temperature. Due to the mismatch of thermal expansion coefficients(TEC) of different materials， thermal cycles can cause the bonding's fatigue and failure， even cause the disfunction of satellites. By using the thermal cycle equipment (TCE-a) developed by SITP， the vaccum environment and stirling cooler's intermittent working modes were simulated， and two failure modes of indium solder-bump were discovered. And the finite elements method (FEM) was used to analyze the mechanism of bumps' failure.