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Journals >
Infrared and Laser Engineering >
Volume 51 >
Issue 5 >
Page 20210416 > Article
Infrared and Laser Engineering
Vol. 51, Issue 5, 20210416 (2022)
Laser marking process on transparent materials
Yinan Zhang
1、2
, Wen Sun
1、2、*
, Defeng Mo
1、2
, Qinfei Xu
1、2
, and Xue Li
1、2
Author Affiliations
1
Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
2
Key Laboratory of Infrared Imaging Materials and Devices, Chinese Academy of Sciences, Shanghai 200083, China
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DOI:
10.3788/IRLA20210416
Cite this Article
Yinan Zhang, Wen Sun, Defeng Mo, Qinfei Xu, Xue Li. Laser marking process on transparent materials[J]. Infrared and Laser Engineering, 2022, 51(5): 20210416
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Fig. 1.
Measured ln(
E
p
) versus
D
2
and fitting results
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Fig. 2.
Radial distribution of laser energy density based on fitting results
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Fig. 3.
Measured output spot diameter versus defocus distance of laser processing head
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Fig. 4.
Relative energy density versus defocus distance of output spot of laser processing head
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Fig. 5.
Effects of laser beam scanning angle of laser processing head on the geometry deviation of marking position
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Fig. 6.
Macro photo of laser marking on IR Conning glass at different focusing depths
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Fig. 7.
Photo of laser marking on the upper surface at relative laser power of 9% and 8% with one scan
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Name
Parameters
Remarks
Wavelength
515
(Green)
1030 nm Yb:
YAG doubling
Average laser power/W
15
1%-100% available
Pulse width/ps
<10
Picosecond pulse
Maximum single
pulse energy/μJ
75
1%-100% available
Range of repeat frequency/kHz
200-400
Set 200 kHz on this equipment
Beam quality (
M
2
)
<1.3
Gauss distribution
Table 1.
Laser parameters
View in the Article
Name
Parameter
Designed operation wavelength/nm
515-540
Effective focal length/mm
104.7
Working distance/mm
138.5
Maximum scan angle/(°)
13.1
Scan area/mm
2
46×46
Laser spot diameter/μm
10
Table 2.
Linos F-Theta-Ronar lens and galvanometer scanning parameters of laser processing
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No.
Focus position/mm
Eye observation
Microscope observation
Remarks
1
2
Clear
Clear-two marks
Upper surface
2
1.5
Clear
Clear-two marks
3
1
Clear
Clear-two marks
4
0.5
Clear
Clear-two marks
5
0.4
Clear
Clear-two marks
6
0.3
Clear
Clear-two marks, nearly on the same plane
7
0.2
Clear
Clear-one mark
8
0.1
Clear
Clear-one mark
9
0
Clear
Clear-one mark
Lower surface
10
−0.1
Clear
Faint-one mark
11
−0.2
Faint
Faint-one mark
12
−0.3
Invisible
Invisible
Table 3.
Initial test result of ps laser marking on IR Corning glass
View in the Article
Laser power
Focus position
Marking characteristic
Geometry deviation
Marking effect
Evaluation
Larger
Close to upper surface
Extend from upper surface to lower surface
Little
Etching too more, none geometry deviation
×
Larger
Middle
Extend from middle to both upper and lower surface
Medium
Etching even more, have geometry deviation
×
Larger
Lower surface
Extend from lower surface to upper surface
Large
Etching too more, have geometry deviation
×
Appropriate
Close to upper surface
Less extend from upper surface to lower surface
None
Etching suitable, no geometry deviation
√
Appropriate
Middle
Less extend from middle to upper and lower surface
Medium
Etching suitable, have geometry deviation
×
Appropriate
Lower surface
Less extend from lower surface to upper surface
Large
Etching suitable, have geometry deviation
×
Table 4.
Result and strategy of marking on transparent sample
View in the Article
Abstract
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Figures&Tables (11)
Equations (4)
References (8)
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Yinan Zhang, Wen Sun, Defeng Mo, Qinfei Xu, Xue Li. Laser marking process on transparent materials[J]. Infrared and Laser Engineering, 2022, 51(5): 20210416
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Paper Information
Category: Lasers & Laser optics
Received: Jun. 21, 2021
Accepted: --
Published Online: May. 25, 2022
The Author Email: Sun Wen (jacksunwen@mail.sitp.ac.cn)
DOI:
10.3788/IRLA20210416
Recommended Topics
laser devices and laser physics
Lasers and Laser Optics
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