• Journal of Infrared and Millimeter Waves
  • Vol. 34, Issue 1, 23 (2015)
LIU Xiu-Juan1、2、*, ZHANG Yan1, and LI Xiang-Yang1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3724/sp.j.1010.2015.00023 Cite this Article
    LIU Xiu-Juan, ZHANG Yan, LI Xiang-Yang. Characterization of silicon oxide film grown on GaN deposited by ICPCVD[J]. Journal of Infrared and Millimeter Waves, 2015, 34(1): 23 Copy Citation Text show less
    References

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    [2] REBIB F, TOMASELLA E, DUBOIS M, et al. SiOxNythin films deposited by reactive sputtering: Process study and structural characterisation [J]. Thin Solid Films, 2007, 515(7-8): 3480-3487.

    [3] TOIVOLA Y, THURN J, COOK R F, et al. Influence of deposition conditions on mechanical properties of low-pressure chemical vapor deposited low-stress silicon nitride films [J]. J. Appl. Phys, 2003, 94(10): 6915-6922.

    [4] ZAMBOM L D, MANSANO R D, FURLAN R. Silicon nitride deposited by inductively coupled plasma using silane and nitrogen [J]. Vacuum, 2002, 65(2): 213-220.

    [5] LEE J W, MACKENZIE K D, JOHNSON D, et al. Low temperature silicon nitride and silicon dioxide film processing by inductively coupled plasma chemical vapor deposition [J]. J. Electrochem. Soc., 2000, 147(4): 1481-1486.

    [8] XU Q, RA Y, BACHMAN M, et al. Characterization of low-temperature silicon nitride films produced by inductively coupled plasma chemical vapor deposition [J]. J.Vac.Sci.Technol.A, 2009, 27(1): 145-156.

    [9] TSAI S Y, LU Y M, HON M H, et al. Study on the low leakage current of an MIS structure fabricated by ICP-CVD(C), Journal of Physics: Conference series 100, 2008, 042030.

    [10] KSHIRSAGAR A, NYAUPANE P, BADAS D, et al. Deposition and characterization of low temperature silicon nitride films deposited by inductively coupled plasma CVD [J]. Appl. Surf. Sci., 2011, 257(11): 5052-5058.

    [11] PARK B R, LEE J G, CHOI W, et al. High-quality ICPCVD SiO2 for normally off AlGaN/GaN-on-Si recessed MOSHFETs [J]. IEEE Electron Device Lett., 2013, 34(3): 354-356.

    [13] HASHIZUME T, OOTOMO S, INAGAKI T, et al. Surface passivation of GaN and GaN/AlGaN heterostructures by dielectric films and its application to insulated-gate heterostructure transistors [J]. J. Vac. Sci. Technol. B, 2003, 21(4): 1828-1838.

    [14] HONG M, ANSELM K A, KWO J, et al. Properties of Ga2O3(Ga2O3)/GaN metal-insulator-semiconductor diodes [J]. J. Vac. Sci. Technol. B, 2000, 18(3): 1453-1456.

    [15] ARULKUMARAN S, EGAWAg T, ISHIKAWA H, et al. Investigations of SiO2/n-GaN and Si3N4/n-GaN insulator-semiconductor interfaces with low interface state density [J]. Appl. Phys. Lett., 1998, 73(6): 809-811.

    LIU Xiu-Juan, ZHANG Yan, LI Xiang-Yang. Characterization of silicon oxide film grown on GaN deposited by ICPCVD[J]. Journal of Infrared and Millimeter Waves, 2015, 34(1): 23
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