[1] Kai CUI, Congxiang WANG, Yongfang HU. Development and application of 2.5D／3D packaging technology for RF microsystem. Electro-Mechanical Engineering, 32, 1-6(2016).

[2] ROYR , SCHAFERT . Bump detection in process flow. Application of IC, 7, 41-44(2006).

[3] J H LAU. 集成电路三维系统集成与封装工艺. 曹立强, 刘丰满, 王启东, 译(2017).

[4] M GEFFEN, Y LEVI. Confocal wafer-inspection system.

[5] A SCHICK, M KEDZIORA. Inspection and process evaluation for flip chip bumping and CSP by scanning 3D confocal microscopy, 116-119(2002).

[6] SEMICONDUCTORUNITY . Chromatic confocal device and method for 2D/3D inspection of an object such as a wafer.

[7] Y HU, Q CHEN, T TAO et al. Absolute three-dimensional micro surface profile measurement based on a Greenough-type stereomicroscope. Measurement Science and Technology, 28, 045004(2017).

[8] Y HU, Q CHEN, S FENG et al. A new microscopic telecentric stereo vision system - Calibration, rectification, and three-dimensional reconstruction. Optics and Lasers in Engineering, 113, 14-22(2019).

[9] S MATHUR, C Y CHANG. System and method for inspection using white light interferometry.

[10] K W KO, J H SIM, M Y KIM. A high-speed white-light scanning interferometer for bump inspection of semiconductor manufacture. Journal of the Korean Society for Precision Engineering, 30, 702-708(2013).

[11] C J TAY, S H WANG, C QUAN et al. Measurement of a micro-solder ball height using a laser projection method. Optics Communications, 234, 77-86(2004).

[12] Y NISHIYAMA, H TSUKAHARA, Y OSHIMA et al. Development of high-speed 3D inspection system for solder bumps, 3306, 60-67(1998).

[13] M F M COSTA. Optical triangulation-based microtopographic inspection of surfaces. Sensors, 12, 4399-4420(2012).

[14] M BEN-LEVI. System and method for height triangulation measurement.

[15] Z HE, J SCHAEFER. High speed 3D inspection of advanced package interconnect uniformity, 1-6(2018).

[16] Tairan ZHANG. Application of optics in precision measurement. China Equipment Engineering, 23, 84-85(2018).

[17] F M MANUEL, C V TEIXEIRA. Residual stress measurement in PVD optical coatings by microtopography. Measurement, 44, 549-553(2011).

[18] A M TAPILOUW, Y W CHANG, H W LIU et al. White light triangulation sensor for flexible inspection system, 765-768(2015).

[19] J FENG, Q FENG, C KUANG. Present status of high precision laser displacement sensor based on triangulation. Journal of Applied Optics, 3, 33-36(2004).

[20] Jinren LU, Yuanqing HUANG. Laser triangulation method for surface measurement. Journal of Xiamen University (Natural Science), 43, 56-59(2004).

[21] Guichun CHI, Zhaofei ZHOU, Shihua WANG. Laser triangle method for measuring microdisplacement. Tool Engineering, 6, 37-40(1997).

[22] Hao CUI, Rui GUO, Xingqianget al LI. The calibration of laser triangular displacement sensor based on nonlinear fitting. Chinese Journal of Lasers, 47, 0904003(2020).

[23] De XU. Measurement and control based on microscopic vision, 47-51(2014).

[24] Yingying LI, Zhiyi ZHANG, Lin YUAN. Survey on linear structured light stripe center extraction. Laser & Optoelectronics Progress, 50, 13-22(2013).

[25] J TANG, X LIU, L CHAI et al. Calibration experiments on a visual measurement system for pinion gears(2019).

[26] K G DERPANIS. Overview of the RANSAC algorithm. Image Rochester NY, 4, 2-3(2010).

[27] Yetai FEI. Error theory and data processing(2005).