Peng WANG, Fanchang MENG, Zili ZHANG, Dezhao WANG, Shan WANG, Entao YAO, Lei WANG, Ruiqian YE. A Bump Height Measurement Method Based on Optical Triangulation[J]. Acta Photonica Sinica, 2022, 51(5): 0512001
- Acta Photonica Sinica
- Vol. 51, Issue 5, 0512001 (2022)
Fig. 1. Structure of chip bump under scanning electron microscope
Fig. 2. Schematic diagram of oblique incidence optical triangulation
Fig. 3. Schematic diagram of chip bump height mathematical model
Fig. 4. Experimental device for measuring chip bump height
Fig. 5. RANSAC circle test results
Fig. 6. Chip bump height measurement results
|
Table 1. Comparison between displacement measured by laser interferometer and strip center displacement
|
Table 2. Chip bump height measurement error result
Set citation alerts for the article
Please enter your email address
© Copyright 2018-2021 | Chinese Laser Press. All Rights Reserved 沪ICP备15018463号-20