• Acta Optica Sinica
  • Vol. 28, Issue 2, 349 (2008)
Liu Yanting*, Ni Wei, and Wu Xingkun
Author Affiliations
  • [in Chinese]
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    Liu Yanting, Ni Wei, Wu Xingkun. A Soft-Lithography-Based Vertically Coupling Structure for Multilayered Optical Interconnection[J]. Acta Optica Sinica, 2008, 28(2): 349 Copy Citation Text show less

    Abstract

    A novel vertical coupling structure is designed for multilayered optical interconnection, regarding as one of most promising approaches for high-speed communications in next-generation computer. The layer-to-layer coupling features a simple S-shaped structure with an insertion loss as low as 0.05 dB. For four cross sections of 30 μm×30 μm, 50 μm×50 μm,100 μm×100 μm, and 200 μm×200 μm calculations for cross-over of up to 6 layers were performed using Monte Carlo ray tracing simulation, it was found that a low-loss coupling (less than 1 dB) can be achieved as the ratio of cross-over height to traveling distance is about 0.128. Experimental prototypes were fabricated by using soft-lithography and measurement agrees with the calculated result in general.
    Liu Yanting, Ni Wei, Wu Xingkun. A Soft-Lithography-Based Vertically Coupling Structure for Multilayered Optical Interconnection[J]. Acta Optica Sinica, 2008, 28(2): 349
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