Research on Packaging of Thermoelectric MEMS Microwave Power Sensors

TANG Meng; YU Wenting; ZHU Yucheng; SUN Lilu; HUA Rui; WANG Debo

doi:10.13911/j.cnki.1004-3365.210467

[1] REBEIZ G M. RF MEMS: theory, design and technology ［M］. Boston: John Wiley & Sons, 2003: 1-20.

[2] YAN J B, LIAO X P. Research on the response time of indirect-heating microwave power sensor ［J］. IEEE Sensors J, 2016, 16(13): 5270-5276.

[4] ZHANG Z, MA Y. DC-25 GHz and low-loss MEMS thermoelectric power sensors with floating thermal slug and reliable back cavity based on GaAs MMIC technology ［J］. Micromachines, 2018, 9(4): 154.

[5] CHEN C, LIAO X P, CHU C L, et al. Modeling of MEMS microwave integrated detector applied to 8-12 GHz receiver ［J］. Sol Sta Elec, 2019, 160: 107626.1- 107626.8.

[6] LI J H, LIAO X P, CHU C L. A novel thermistor-based RF power sensor with wheatstone bridge fabricating on MEMS membrane ［J］. J Microelectromechan Syst, 2020, 29(5): 1314-1321.

[7] JAEGGI D, BALTES H, MOSER D. Thermoelectric AC power sensor by CMOS technology ［J］. IEEE Elec Dev Lett, 1992, 13(7): 366-368.

[11] WANG D B, ZUO W, JIN L S, et al. A novel 3-D equivalent circuit model of thermoelectric MEMS microwave power sensors ［J］. IEEE Trans Elec Dev, 2021, 68(6): 2931-2937.

[12] KIM K I, KIM Jungmu, KIM Jongman, et al. Packaging method for RF MEMS devices using LTCC capping substrate and BCB adhesive bonding ［C］// Transducers. Seoul, South Korea. 2005: 1092- 1095.

[13] MARGOMENOS A, KATEHI L P B. Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS ［J］. IEEE Trans Microw Theo Tech, 2004, 52(6): 1626-1636.

[14] HUA D, TAN J, CAI C. Packaging research for X-band microwave phase detector based on thermoelectric power sensor ［C］// IEEE 9th ICCSN. Guangzhou, China. 2017: 737-741.

[15] JOUNG Y H, ALLEN M G. Chip-to-board micromachining for interconnect layer passive components ［J］. IEEE Trans Compon Packag Tech, 2007, 30(1): 15-23.