• Opto-Electronic Engineering
  • Vol. 30, Issue 6, 32 (2003)
[in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], and [in Chinese]
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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. An infrared temperature-measuring system for a small high-temperature region on semiconductor substrate[J]. Opto-Electronic Engineering, 2003, 30(6): 32 Copy Citation Text show less
    References

    [1] YE Yutang. Laser assisted microprocessing: the first edition[M]. Chengdu: Press of University of electronic science and technology, 1995. (In Chinese)

    [2] YE Yutang, LI Zhongdong, HONG Yonghe, et al. Pulsed Nd:YAG laser induced diffusion of Zn into GaAs using solid state diffusion source[J]. ACTA OPTICASINICA, 1997, 17 (4): 419-422. (In Chinese)

    [3] YE Yutang, LI Zhongdong, HONG Yonghe, et al. Continuous wave CO2 laser induced diffusion of Zn into GaAs using a solid state diffusion source [J]. Chinese Journal of Lasers, 1997, 24(3): 237-241. (In Chinese)

    [4] BAUMGARTNER P, WEGSCHEIDER W, BICHIER M, et al. Single-electron transistor fabricated by focused laser beam-induced doping ofaGaAs/AlGaAs heterostructure[J]. Appl. Phys. Lett, 1997, 70(16): 2135-2137.

    [5] BONCHIK AY, KIJAK S G, GOTRA Z, et al. Laser technology for submicron-doped layers formation in semiconductors [J].Optics &Laser Technology, 2001, 33.. 589-591.

    [6] YE Yutang, LI Zhongdong, HONG Yonghe, et al. Remote sensing of the temperature of the exposed region in laser assisted diffusion [J]. Journal of applied sciences, 1997, 15(4): 413-417 .(In Chinese)

    [7] GUIDOTTI D, WILMAN J G Novel and nonintrusive optical thermometer [J]. Appl. Phys. Lett, 1992, 60(5): 524-526.

    [8] LAX M. Temperature rise induced by a laser beam[J]. Journal of Applied Physics, 1977, 48(9): 3919-3924.

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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. An infrared temperature-measuring system for a small high-temperature region on semiconductor substrate[J]. Opto-Electronic Engineering, 2003, 30(6): 32
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