• Semiconductor Optoelectronics
  • Vol. 44, Issue 4, 525 (2023)
LIU Geyang1, LIU Changju1、2、*, ZHAI Jianghao1, LI Ming1, XU Jiangtao2, WANG Xiaodong1, and REN Siwei1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.16818/j.issn1001-5868.2023052001 Cite this Article
    LIU Geyang, LIU Changju, ZHAI Jianghao, LI Ming, XU Jiangtao, WANG Xiaodong, REN Siwei. Design of A Multispectral TDI-CMOS Image Sensor Readout Circuit[J]. Semiconductor Optoelectronics, 2023, 44(4): 525 Copy Citation Text show less
    References

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    [2] Bello D S S, Boulenc P, Vandebriel R, et al. A 7-band CCD-in-CMOS multispectral TDI imager[C]// Inter. Image Sensor Workshop, 2017: 129-132.

    [3] Boulenc P, Thijs S, Bello D S S, et al. Multi-spectral high-speed backside illuminated TDI CCD-in-CMOS imager[C]// Inter. Image Sensor Workshop, 2019: R47.

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    [6] Chen Y, Xu Y, Mierop A J, et al. Column-parallel digital correlated multiple sampling for low-noise CMOS image sensors[J]. IEEE Sensors J., 2011, 12(4): 793-799.

    [7] Kawai N, Kawahito S. Effectiveness of a correlated multiple sampling differential averager for reducing 1/f noise[J]. IEICE Electronics Express, 2005, 2(13): 379-383.

    [8] Suh S, Itoh S, Aoyama S, et al. Column-parallel correlated multiple sampling circuits for CMOS image sensors and their noise reduction effects[J]. Sensors, 2010, 10(10): 9139-9154.

    [9] Guo J. DLL based single slope ADC for CMOS image sensor column readout[D]. Delft: TU Delft, 2011.

    [10] Gao W, Gao D, C Huguo, et al. Design of a 12-bit 2.5 MS/s integrated multi-channel single-ramp analog-to-digital converter for imaging detector systems[J]. IEEE Trans. on Instrumentation and Measurement, 2011, 60(6): 1942-1951.

    [11] Turchetta R, Guerrini N, Sedgwick I. Large area CMOS image sensors[J]. J. of Instrumentation, 2011, 6(1): C01099.

    LIU Geyang, LIU Changju, ZHAI Jianghao, LI Ming, XU Jiangtao, WANG Xiaodong, REN Siwei. Design of A Multispectral TDI-CMOS Image Sensor Readout Circuit[J]. Semiconductor Optoelectronics, 2023, 44(4): 525
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