• Optics and Precision Engineering
  • Vol. 31, Issue 1, 99 (2023)
Xiao CHEN1,3, Jinyang KE2, Zhongdi SHE2,3, Jianguo ZHANG2, and Jianfeng XU2,3,*
Author Affiliations
  • 1School of Mechanical Engineering, Hubei University of Technology, Wuhan430068, China
  • 2School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan430074, China
  • 3National Innovation Institute of Digital Design and Manufacturing, Wuhan40206, China
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    DOI: 10.37188/OPE.20233101.0099 Cite this Article
    Xiao CHEN, Jinyang KE, Zhongdi SHE, Jianguo ZHANG, Jianfeng XU. Optimization of process parameters and surface characteristics in laser-assisted ultra-precision cutting of monocrystalline silicon[J]. Optics and Precision Engineering, 2023, 31(1): 99 Copy Citation Text show less
    Laser in situ assisted ultra-precision cutting experimental devices
    Fig. 1. Laser in situ assisted ultra-precision cutting experimental devices
    Distribution of residual difference for surface roughness
    Fig. 2. Distribution of residual difference for surface roughness
    Main effect diagram for mean value of surface roughness signal-to-noise ratio
    Fig. 3. Main effect diagram for mean value of surface roughness signal-to-noise ratio
    Monocrystalline silicon aspheric lens with diameter of 165 nm machined by in situ laser assisted ultra-precision machining
    Fig. 4. Monocrystalline silicon aspheric lens with diameter of 165 nm machined by in situ laser assisted ultra-precision machining
    Micrographs of diamond tool
    Fig. 5. Micrographs of diamond tool
    Residual stress on machined surface of monocrystalline silicon
    Fig. 6. Residual stress on machined surface of monocrystalline silicon
    Surface charateristics of silicon machine by laser assisted ultra-precision cutting
    Fig. 7. Surface charateristics of silicon machine by laser assisted ultra-precision cutting
    工艺因素单位水平1水平2水平3水平4
    主轴转速sr/min1500250035004500
    进给速率fmm/min1357
    切削深度dcμm36912
    激光功率pW1.52.53.54.5
    Table 1. Processing factors and level of orthogonal test
    序号主轴转速s/(r·min-1进给速率f/(mm·min-1切削深度dc/μm激光功率p/W粗糙度Sa/nm
    11 500131.54.950
    21 500362.516.977
    31 500593.52.663
    41 5007124.54.121
    52 500163.59.455
    62 500334.58.170
    72 5005121.510.338
    82 500792.514.307
    93 500194.511.820
    103 5003123.511.228
    113 500532.55.192
    123 500761.58.538
    134 5001122.55.620
    144 500391.512.421
    154 500564.57.346
    164 500733.510.343
    Table 2. 正交表与加工表面粗糙度结果
    参数自由度平方和均方和P贡献率/%
    s323.267.750.83710.11
    f373.0224.340.53831.73
    dc335.7411.910.74515.53
    p315.785.260.8966.86
    Table 3. Variance of surface roughness in orthogonal test
    Xiao CHEN, Jinyang KE, Zhongdi SHE, Jianguo ZHANG, Jianfeng XU. Optimization of process parameters and surface characteristics in laser-assisted ultra-precision cutting of monocrystalline silicon[J]. Optics and Precision Engineering, 2023, 31(1): 99
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