Three-dimensional light-emitting diodes (LEDs) have been the preferred light source for bulb lamp due to their 360° illumination. However, compared with other light sources, this encapsulation requires better cooling function owing to its heat dissipation channel changing from longitudinal to transverse. Therefore, this work attempts to design the best thermal dissipation model of the three-dimensional LEDs through thermal simulation software. By comparing optimization of the substrate and chip pattern mode, the temperature of substrate decreases from 130 ℃ to 83 ℃ under the same drive current condition. In order to verify the accuracy of simulation, two samples are made to test the performances of thermal dissipation. The temperature of samples can achieve equilibrium in 300 s. Moreover, the test results are in accord with the simulation results. Experimental results show that the optimization of three- dimensional light- emitting LED lights with good heat dissipation performance can satisfy the industrialization product demand of the three-dimensional light-emitting LED lights.