• Chinese Physics B
  • Vol. 29, Issue 8, (2020)
Yao-Peng Zhao, Chong Wang, Xue-Feng Zheng, Xiao-Hua Ma, Kai Liu, Ang Li, Yun-Long He, and Yue Hao
Author Affiliations
  • Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi’an 710071, China
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    DOI: 10.1088/1674-1056/ab8daa Cite this Article
    Yao-Peng Zhao, Chong Wang, Xue-Feng Zheng, Xiao-Hua Ma, Kai Liu, Ang Li, Yun-Long He, Yue Hao. Comparative study on characteristics of Si-based AlGaN/GaN recessed MIS-HEMTs with HfO2 and Al2O3 gate insulators[J]. Chinese Physics B, 2020, 29(8): Copy Citation Text show less
    Schematic cross-sectional structure of AlGaN/GaN gate-recessed MIS-HEMT.
    Fig. 1. Schematic cross-sectional structure of AlGaN/GaN gate-recessed MIS-HEMT.
    Photomicrograph of (a) MIS-HEMT device and (b) FIB cross-sectional view of gate area.
    Fig. 2. Photomicrograph of (a) MIS-HEMT device and (b) FIB cross-sectional view of gate area.
    Energy band diagram of AlGaN/GaN gate-recessed MIS-HEMT.
    Fig. 3. Energy band diagram of AlGaN/GaN gate-recessed MIS-HEMT.
    Molecular structure diagram of HfO2/AlGaN and Al2O3/AlGaN interfaces.
    Fig. 4. Molecular structure diagram of HfO2/AlGaN and Al2O3/AlGaN interfaces.
    Curves of dielectric layer breakdown voltage of devices.
    Fig. 5. Curves of dielectric layer breakdown voltage of devices.
    Curves of transfer characteristics of recessed MIS-HEMT with (a) 6-nm-thick barrier, (b) 3-nm-thick barrier, and (c) 0-nm-thick barrier, and (d) change trend comparison chart of Vth and Gm.
    Fig. 6. Curves of transfer characteristics of recessed MIS-HEMT with (a) 6-nm-thick barrier, (b) 3-nm-thick barrier, and (c) 0-nm-thick barrier, and (d) change trend comparison chart of Vth and Gm.
    The C–V curves of gate-recessed MIS-HEMT.
    Fig. 7. The CV curves of gate-recessed MIS-HEMT.
    Plots of drift mobility versus gate voltage Vg of electron for HfO2 and Al2O3 barriers with different thickness values.
    Fig. 8. Plots of drift mobility versus gate voltage Vg of electron for HfO2 and Al2O3 barriers with different thickness values.
    Pulsed output current curves of devices.
    Fig. 9. Pulsed output current curves of devices.
    Comparisons of change trend of Ron and current collapse betwen HfO2 and Al2O3 MIS-HEMTs at maximum gate voltage.
    Fig. 10. Comparisons of change trend of Ron and current collapse betwen HfO2 and Al2O3 MIS-HEMTs at maximum gate voltage.
    Yao-Peng Zhao, Chong Wang, Xue-Feng Zheng, Xiao-Hua Ma, Kai Liu, Ang Li, Yun-Long He, Yue Hao. Comparative study on characteristics of Si-based AlGaN/GaN recessed MIS-HEMTs with HfO2 and Al2O3 gate insulators[J]. Chinese Physics B, 2020, 29(8):
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