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    Journals >Microelectronics >Volume 52 >Issue 5 >Page 843 > Article
    • Microelectronics
    • Vol. 52, Issue 5, 843 (2022)
    Research on Preventing Solder Joint Cracking Technology of SOD-323 Device
    JIANG Dongyi, ZHANG Chunya, and HUANG Ji
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    DOI: 10.13911/j.cnki.1004-3365.220329 Cite this Article
    JIANG Dongyi, ZHANG Chunya, HUANG Ji. Research on Preventing Solder Joint Cracking Technology of SOD-323 Device[J]. Microelectronics, 2022, 52(5): 843 Copy Citation Text show less
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    JIANG Dongyi, ZHANG Chunya, HUANG Ji. Research on Preventing Solder Joint Cracking Technology of SOD-323 Device[J]. Microelectronics, 2022, 52(5): 843
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