• Optoelectronics Letters
  • Vol. 14, Issue 5, 363 (2018)
Yang LIU1, Wei LIU1、*, Meng-xin CHEN2, Si-han SHI1, Zhi-chao HE1, Jin-long GONG2, Tuo WANG2, Zhi-qiang ZHOU1, Fang-fang LIU1, Yun SUN1, and Shu XU3
Author Affiliations
  • 1Tianjin Key Laboratory of Thin Film Devices and Technology, Institute of Photoelectronic Thin Film Devices and Technology, Nankai University, Tianjin 300071, China
  • 2Key Laboratory for Green Chemical Technology of Ministry of Education, Collaborative Innovation Center of Chemical Science and Engineering (Tianjin), School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China
  • 3Davidson School of Chemical Engineering, Purdue University, West Lafayette IN47907, USA
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    DOI: 10.1007/s11801-018-8036-7 Cite this Article
    LIU Yang, LIU Wei, CHEN Meng-xin, SHI Si-han, HE Zhi-chao, GONG Jin-long, WANG Tuo, ZHOU Zhi-qiang, LIU Fang-fang, SUN Yun, XU Shu. The impact of Al2O3 back interface layer on low-temperature growth of ultrathin Cu(In,Ga)Se2 solar cells[J]. Optoelectronics Letters, 2018, 14(5): 363 Copy Citation Text show less

    Abstract

    With reducing the absorber layer thickness and processing temperature, the recombination at the back interface is se-vere, which both can result in the decrease of open-circuit voltage and fill factor. In this paper, we prepare Al2O3 by atomic layer deposition (ALD), and investigate the effect of its thickness on the performance of Cu(In,Ga)Se2 (CIGS) solar cell. The device recombination activation energy (EA) is increased from 1.04 eV to 1.11 eV when the thickness of Al2O3 is varied from 0 nm to 1 nm, and the height of back barrier is decreased from 48.54 meV to 38.05 meV. An effi-ciency of 11.57 % is achieved with 0.88-μm-thick CIGS absorber layer.
    LIU Yang, LIU Wei, CHEN Meng-xin, SHI Si-han, HE Zhi-chao, GONG Jin-long, WANG Tuo, ZHOU Zhi-qiang, LIU Fang-fang, SUN Yun, XU Shu. The impact of Al2O3 back interface layer on low-temperature growth of ultrathin Cu(In,Ga)Se2 solar cells[J]. Optoelectronics Letters, 2018, 14(5): 363
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