• Infrared and Laser Engineering
  • Vol. 46, Issue 10, 1005003 (2017)
Zhu Qiwen1、2、*, Zhang Pu1, Wu Dihai1, Nie Zhiqiang1, Xiong Lingling1, and Liu Xingsheng1、3
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
  • show less
    DOI: 10.3788/irla201746.1005003 Cite this Article
    Zhu Qiwen, Zhang Pu, Wu Dihai, Nie Zhiqiang, Xiong Lingling, Liu Xingsheng. Thermal characteristics of kW-level conduction-cooled semiconductor laser array[J]. Infrared and Laser Engineering, 2017, 46(10): 1005003 Copy Citation Text show less
    References

    [1] Liu Xingsheng, Martin H Hu, Caneau C G, et al. Thermal management strategies for high power semiconductor pump lasers[J]. IEEE Transactions on Components and Packaging Technologies, 2006, 29(2): 268-276.

    [2] Ma Xiaoyu, Wang Jun, Liu Suping. Present situation of investigations and applications in high power semiconductor lasers[J]. Infrared and Laser Engineering, 2008, 37 (2):189-194. (in Chinese)

    [3] Tian Kun, Zou Yonggang, Ma Xiaohui, et al. Surface emitting distributed feedback semiconductor lasers[J]. Chinese Optics, 2016, 9(1): 51-64. (in Chinese)

    [4] Huang Haihua, Liu Yun, Yang Ye, et al. Temperature characteristics of 850 nm tapered semiconductor lasers[J]. Chin Opt, 2013, 6(2): 201-207. (in Chinese)

    [5] Quan Wei, Li Guanghui, Chen Xi, et al. Structural design and ANSYS thermal simulation for semiconductor laser system[J]. Optics and Precision Engineering, 2016, 24(5): 1080-1086. (in Chinese)

    [6] Liu Xingsheng, Zhao Wei, Xiong Lingling, et al. Packaging of High Power Semiconductor Lasers[M]. New York: Springer, 2014.

    [7] Zhang Zhiyong, Zhang Pu, Nie Zhiqiang, et al. Thermal crosstalk of high-power diode laser array[J]. High Power Laser and Particle Beams, 2013, 25(8): 1904-1910. (in Chinese)

    [8] Lu Guoguang, Huang Yun, Lei Zhifeng. Lifetime evaluation on high power cm-bars[J]. Infrared and Laser Engineering, 2012, 41(9): 2328-2332. (in Chinese)

    [9] Wang Wen, Gao Xin, Zhou Zepeng, et al. Steady-state thermal analysis of hundred-watt semiconductor laser with multichip-packaging[J]. Infrared and Laser Engineering, 2014, 43(5): 1438-1443. (in Chinese)

    [10] Wang Shuna, Zhang Pu, Nie Zhiqiang, et al. Numerical modeling of the influence of temperature and driving current on "smile" in high power diode laser arrays[C]//Electronic Packaging Technology (ICEPT), 2015 16th International Conference on IEEE, 2015: 95-101.

    [11] Tian Zhenhua, Sun Chenling, Cao Junsheng, et al. Junction temperature measurement of high power diode lasers[J]. Optics and Precision Engineering, 2011, 19(6): 1244-1249. (in Chinese)

    [12] Zhang Pu, Wang Jingwei, Hou Dong, et al. A 3 000 W 808 nm QCW G-stack semiconductor laser array[C]//XX International Symposium on High Power Laser Systems and Applications. International Society for Optics and Photonics, 2015: 92550W-1-7.

    Zhu Qiwen, Zhang Pu, Wu Dihai, Nie Zhiqiang, Xiong Lingling, Liu Xingsheng. Thermal characteristics of kW-level conduction-cooled semiconductor laser array[J]. Infrared and Laser Engineering, 2017, 46(10): 1005003
    Download Citation