[3] Rahul Chakraborty, Reddy Subba B. IEEE Transactions on Dielectrics and Electrical Insulation, 2017, 24(1): 1751.
[4] Xue Y, Li X F, Zhang D H, et al. Composites Science and Technology, 2018, 155: 137.
[5] Mansab Ali, Reuben Hackam. IEEE Transactions on Dielectrics and Electrical Insulation, 2009, 16(3): 842.
[6] Alok Ranjan Verma, Reddy Subba B. IEEE Transactions on Dielectrics and Electrical Insulation, 2018, 25(1): 46.
[11] Bok-Hee Youn, Chang-Su Huh. IEEE Transactions on Dielectrics and Electrical Insulation, 2005, 12(5): 1015.
