[5] Wang G Z., Cheng Z N., Becke K R, et al. Applying Anand model to represent the viscoplastic deformation behavior of solder alloys[J]. Journal of Electronic Packaging,2001,123(3):247—253.
[6] Wilde J, Becker K, Thoben M, et al. Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder[J]. IEEE Transactions on Advanced Packaging,2000,23(3):408—414.
[7] Chang R W, Patrick Mccluskey F. Constitutive relations of indium in extreme-temperature electronic packaging based on Anand model[J]. Journal of Electronic Materials,2009,38(9):1855—1859.
[8] Kim S, Ledbetter H. Low-temperature elastic coefficients of polycrystalline indium[J]. Materials Science and Engineering A,1998,252(1):139—143.
[9] Hermida E B, Melo D G, Aguiar J C, et al. Temperature dependence of the viscoelastic response of In, Sn and In-Sn alloys[J]. Journal of Alloys and Compounds,2000,310(1):91—96.
[10] Reed R P, Mc Cowan C N, Walsh R P. Tensile strength and ductility of indium[J]. Materials Science and Engineering,1988,102(2):227—236.