The dewar cold head structure of the infrared detector is easily damaged by temperature impact, which directly leads to the failure of infrared detector components. This is one of the inevitable reliability problems in the development of infrared detector components. The low temperature reliability of the dewar cold head in the infrared detector was studied. Combined with the bonding failure principle and finite element simulation, the influence of adhesive thickness and overflow on the low temperature stress of dewar cold head, the relationship between the bonding area of cold head and cold finger and the detector temperature was discussed. The results show that the state of the adhesive layer is an important factor affecting the low temperature damage and temperature conduction of the dewar cold head. In the process of product development, the low temperature stress of the large array detector bonding structure can be reduced by controlling the adhesive layer, so as to improve the low temperature reliability of the cold head structure.