Micro-channel etching characteristics enhancement by femtosecond laser processing high-temperature lattice in fused silica glass

Dongkai Chu; Xiaoyan Sun; Youwang Hu; Xinran Dong; Kai Yin; Zhi Luo; Jianying Zhou; Cong Wang; Ji'an Duan

doi:10.3788/COL201715.071403

Journals >Chinese Optics Letters >Volume 15 >Issue 7 >Page 071403 > Article

Chinese Optics Letters
Vol. 15, Issue 7, 071403 (2017)

Micro-channel etching characteristics enhancement by femtosecond laser processing high-temperature lattice in fused silica glass

Dongkai Chu, Xiaoyan Sun, Youwang Hu^*, Xinran Dong, Kai Yin, Zhi Luo, Jianying Zhou, Cong Wang, and Ji'an Duan

Author Affiliations

The State Key Laboratory of High Performance Complex Manufacturing, College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China

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DOI: 10.3788/COL201715.071403 Cite this Article Set citation alerts

Dongkai Chu, Xiaoyan Sun, Youwang Hu, Xinran Dong, Kai Yin, Zhi Luo, Jianying Zhou, Cong Wang, Ji'an Duan. Micro-channel etching characteristics enhancement by femtosecond laser processing high-temperature lattice in fused silica glass[J]. Chinese Optics Letters, 2017, 15(7): 071403 Copy Citation Text

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Fig. 1. Schematic diagram of the ultrafast double pulse femtosecond lasers fabrication system. M, mirror; ND, neutral density attenuator.

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Top view (XZ plane) SEM images (a) where Φ is 0°; (b) where Φ is 90°.

Fig. 2. Top view (XZ plane) SEM images (a) where

Φ

is 0°; (b) where

Φ

is 90°.

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Fig. 3. (a) Microscopic images of the etched micro-channel irradiated by different time delays. (b) Etching rate of a single pulse and a double pulse.

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Fig. 4. Side view (YZ plane) the light entrance SEM images of long range periodic nanostructures formed by different time delays after being polished and shortly etched. (a)