[1] Park S J, Jang D, Lee K S. Thermal performance and orientation effect of an inclined cross-cut cylindrical heat sink for LED light bulbs[J]. International Journal of Heat and Mass Transfer, 2016, 103: 1371-1377.
[2] Yang Chu, Jin Shangzhong, Shao Maofeng, et al. Research on LED performance of glass substrate with COB packaging[J]. Laser & Optoelectronics Progress, 2015, 52(1): 012304.
[3] Mei Jianjian, Liu Lilan. Research on white light color temperature deviation based on tricolor LEDs[J]. Acta Optica Sinica, 2016, 36(8): 0833001.
[4] Zeng Dan, Peng Dongsheng, Jiang Yue. LED freeform lens design for roundabout crossing illumination[J]. Laser & Optoelectronics Progress, 2016, 53(7): 072202.
[6] Jin Shangzhong, Zhang Zaixuan, Hou Minxian, et al. Research on temperature property of illumination white LED[J]. Chinese Journal of Luminescence, 2002, 23(4): 399-402.
[9] Chen Zhenyi, Li Yang, Wang Yiran, et al. The optical properties of a new type of three-dimensional light-emitting COB LED[J]. China Light & Lighting, 2015(11): 45-48.
[10] Yang Lei, Qian Xinglu, Qu Shiwei, et al. Flip chip LED filament optical performance analysis under different electric current[J]. China Light & Lighting, 2015(12): 29-32.
[11] Liu W, Li N, Lei P, et al. Reliability test and failure analysis of high-brightness LEDs from Cree under the various injection currents[C]. 2013 14th International Conference on Electronic Packaging Technology, 2013: 1184-1188.
[12] Li Bingqian. Lumen efficiency of 1 W-level high power white LED[J]. Semiconductor Optoelectronics, 2005, 26(4): 314-316.
[14] Wang Jian, Huang Xian, Liu Li, et al. Effect of temperature and current on LED luminous efficiency [J]. Chinese Journal of Luminescence, 2008, 29(2): 358-362.
[15] Dal L M, Meneghini M, Trivellin N, et al. Phosphors for LED-based light sources: thermal properties and reliability issues[J]. Microelectronics Reliability, 2012, 52(9): 2164-2167.
[17] Ye H, Koh S, Yuan C A, et al. Thermal analysis of phosphor in high brightness LED[C]. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, 2012: 1535-1539.
[18] Sun L, Zhu J, Wong H. Simulation and evaluation of the peak temperature in LED light bulb heatsink[J]. Microelectronics Reliability, 2016, 61: 140-144.