Fig. 1. Schematic diagram of the principle of dual galvanometer laser scanning method

Fig. 2. Schematic diagrams of the laser beam projections. (a) X-Z plane; (b) Y-Z plane

Fig. 3. Schematic diagram of the dual galvanometer laser scanning processing system

Fig. 4. Dual galvanometer laser scanning path for cylindrical hole drilling. (a) Laser scanning path on the X-Y plane; (b) laser scanning path on the X-Z plane

Fig. 5. Processing results when the max laser angle-of-incidence was 3°. (a) Entrance morphology; (b) sidewall morphology; (c) schematic diagram of sidewall taper formation; (d) three-dimensional topography of the sidewall halfway through the processing

Fig. 6. Effect of laser angle-of-incidence (AOI) on the material removal efficiency. (a) Schematic diagram of the effect of laser angle-of-incidence on the laser energy density at the bottom of the hole; (b) schematic diagram of the effect of laser angle-of-incidence on the laser energy density at the sidewall of the hole; (c) effect of laser angle-of-incidence on the sidewall taper of the hole

Fig. 7. Edge compensation scanning processing method. (a) Step-by-step schematic diagram of the processing method; (b) effect of laser angle-of-incidence on the sidewall taper of the hole during edge compensation scanning processing

Fig. 8. Processing results of the straight wall circular hole. (a) Entrance morphology; (b) heat-affected zone (HAZ) at the entrance; (c) macroscopic morphology of the sidewall; (d) micro morphology of the sidewall; (e) exit morphology; (f) exit HAZ