Effect of TSV structure on ring matter wave guide

LUO Xiaojia; YANG Lijun; LUO Junjie

doi:10.11805/tkyda2020055

[1] BERMAN P R. Atom interferometry[M]. San Diego,CA,USA:Academic Press, 1997.

[2] GUSTAVSON T L, BOUYER P, KASEVICH M A. Precision rotation measurements with an atom interferometer gyroscope[J].Physical Review Letters, 1997,78(11):2046-2049.

[3] PANDEY S, MAS H, DROUGAKIS G, et al. Hypersonic Bose-Einstein condensates in accelerator rings[J]. Nature, 2019, 570(7760):205-209.

[4] MOAN E R,HORNE R A,ARPORNTHIP T,et al. Quantum rotation sensing with dual Sagnac interferometers in an atom-optical waveguide[J/OL]. arXiv preprint arXiv:1907.05466, 2019.

[5] MARK K,OMER A,ZHOU S,et al. Fifteen years of cold matter on the atom chip:promise,realizations,and prospects[J]. Journal of Modern Optics, 2016,63(18):1840-1885.

[6] DU S, SQUIRES M B, IMAI Y, et al. Atom-chip Bose-Einstein condensation in a portable vacuum cell[J]. Physical Review A,2004,70(5):053606?1?4.

[7] THYWISSEN J H, OLSHANII M, ZABOW G, et al. Microfabricated magnetic waveguides for neutral atoms[J]. The European Physical Journal D-Atomic,Molecular,Optical and Plasma Physics, 1999,7(3):361-367.

[8] ALZAR C L G. Stability analysis of a magnetic waveguide with self-generated offset field[J]. Physical Review A, 2018, 97(3):033405?1?5.

[9] JIANG Xiaojun, LI Xiaolin, ZHANG Haichao, et al. Smooth Archimedean-spiral ring waveguide for cold atomic gyroscope[J].Chinese Optics Letters, 2016,14(7):070201?1?4.

[10] JIANG Xiaojun, LI Xiaolin, XU Xinping, et al. Archimedean-spiral-based microchip ring waveguide for cold atoms[J]. Chinese Physics Letters, 2015,32(2):020301?1?4.

[13] ZERVAS M, TEMIZ Y, LEBLEBICI Y. Fabrication and characterization of wafer-level deep TSV arrays[C]// 2012 IEEE 62nd Electronic Components and Technology Conference. San Diego,CA,USA:IEEE, 2012:1625-1630.

[14] MIAO M,ZHU Y,JI M,et al. Bottom-up filling of Through Silicon Via(TSV) with parylene as sidewall protection layer[C]// 2009 11th Electronics Packaging Technology Conference. Singapore:IEEE, 2009:442-446.

[15] LIN N, MIAO J. Through-silicon via fabrication with pulse-reverse electroplating for high density nanoelectronics[C]// 2013 IEEE 5th International Nanoelectronics Conference(INEC). Singapore:IEEE, 2013:381-384.