• Laser & Optoelectronics Progress
  • Vol. 56, Issue 11, 111001 (2019)
Qi He1, Yao Li1, Wei Song1, Dongmei Huang1、2、*, Shengqi He1, and Yanling Du1
Author Affiliations
  • 1 College of Information Technology, Shanghai Ocean University, Shanghai 201306, China
  • 2 Shanghai University of Electric Power, Shanghai 200090, China
  • show less
    DOI: 10.3788/LOP56.111001 Cite this Article Set citation alerts
    Qi He, Yao Li, Wei Song, Dongmei Huang, Shengqi He, Yanling Du. Multimodal Remote Sensing Image Classification with Small Sample Size Based on High-Level Feature Fusion[J]. Laser & Optoelectronics Progress, 2019, 56(11): 111001 Copy Citation Text show less

    Abstract

    The training sample size for some objects on the ground is quite small when applying a deep learning model to study the classification of remote sensing images. Meanwhile, diversified remote sensing image acquisition methods generate numerous multimodal remote sensing images with different spatial resolutions. Fusing these multi-modal remote sensing images to remedy the small sample size defect and achieve a highly precise classification of remote sensing images is an urgent problem to be solved. To this end, the present study proposes a fusion method for image classification based on the correlation of two spatial resolutions. A deep learning network is utilized to extract the high-level features of the remote sensing images in two spatial resolutions. Two types of high-level features are integrated via the proposed fusion strategy and further used as the input to train the whole network model. The experimental results demonstrate that the proposed fusion algorithm can achieve high classification accuracy. Further, because different fusion rules have different classification accuracies, a suitable selection can improve the classification accuracy.
    Qi He, Yao Li, Wei Song, Dongmei Huang, Shengqi He, Yanling Du. Multimodal Remote Sensing Image Classification with Small Sample Size Based on High-Level Feature Fusion[J]. Laser & Optoelectronics Progress, 2019, 56(11): 111001
    Download Citation