Calculation and simulation for the factors affecting relative grinding removal in ultra-precision continuous polishing

[in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]

Journals >Opto-Electronic Engineering >Volume 31 >Issue 4 >Page 67 > Article

Opto-Electronic Engineering
Vol. 31, Issue 4, 67 (2004)

Calculation and simulation for the factors affecting relative grinding removal in ultra-precision continuous polishing

[in Chinese]¹, [in Chinese]¹, [in Chinese]², [in Chinese]², [in Chinese]¹, [in Chinese]¹, and [in Chinese]¹

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¹[in Chinese]

²[in Chinese]

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DOI: Cite this Article

[in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Calculation and simulation for the factors affecting relative grinding removal in ultra-precision continuous polishing[J]. Opto-Electronic Engineering, 2004, 31(4): 67 Copy Citation Text

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References

[1] COOKE Frank, BROWN Norman, PROCHNOW Eberhard. Annular Lapping of Precision Optical Flatware [J]. Opt. Eng, 1976, 15(5) : 407-415.

[2] RUPP W J. Conventional optical polishing techniques [J]. Optica Acta, 1971, 18(1) : 1-16.

[3] TESAR A A, FUCHS B A. Removal rates of fused silica with cerium oxide/pitch polishing [J]. SPIE, 1992, 1531: 80-90.

[4] BERGGREN R R, SCHMELL R A. Pad polishing for rapid production of large flats [J]. SPIE, 1997, 3134 : 252-257.

[5] WAGNER R E, SHANNON R R. Fabrication of Aspherics Using a Mathematical Model for Material Removal [J]. Applied Optics, 1974, 13(7): 1683-1689.

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