• Infrared and Laser Engineering
  • Vol. 53, Issue 6, 20240065 (2024)
Jinhui LI, Yingbo ZHU, Shanshan CONG, and Lei ZHANG
Author Affiliations
  • Optical-Mechanical Structure Laboratory, Chang Guang Satellite Technology Co., Ltd., Changchun 130102, China
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    DOI: 10.3788/IRLA20240065 Cite this Article
    Jinhui LI, Yingbo ZHU, Shanshan CONG, Lei ZHANG. Research on bonding method of light detector assembly of space remote sensing camera[J]. Infrared and Laser Engineering, 2024, 53(6): 20240065 Copy Citation Text show less
    Detector assembly structure
    Fig. 1. Detector assembly structure
    Schematic diagram of calculation parameters
    Fig. 2. Schematic diagram of calculation parameters
    Relationship between shear strength of epoxy adhesive and thickness of adhesive layer[14]
    Fig. 3. Relationship between shear strength of epoxy adhesive and thickness of adhesive layer[14]
    Relationship between shear strength of silicone rubber and thickness of adhesive layer[15]
    Fig. 4. Relationship between shear strength of silicone rubber and thickness of adhesive layer[15]
    The schematic diagram of the bonding structure between the detector and the base
    Fig. 5. The schematic diagram of the bonding structure between the detector and the base
    Welding schematic diagram of circuit board and focal plane assembly
    Fig. 6. Welding schematic diagram of circuit board and focal plane assembly
    Testing element
    Fig. 7. Testing element
    Detector component deformation cloud diagram
    Fig. 8. Detector component deformation cloud diagram
    Detector assembly bonding physical entity
    Fig. 9. Detector assembly bonding physical entity
    Temperature change experiment site
    Fig. 10. Temperature change experiment site
    Vibration test condition
    Fig. 11. Vibration test condition
    Vibration test site
    Fig. 12. Vibration test site
    Detector marker points schematic diagram
    Fig. 13. Detector marker points schematic diagram
    PropertiesMeritFaultApplication
    Epoxy resinHigh bonding strength, low curing shrinkage, weather resistanceHigh brittleness, insufficient toughness, difficult to peelAerospace, electronics, optics, etc
    Acrylic resinFast curing, impact resistantDifficult to peel, poor stability, monomer volatileAutomobile fuel tanks, electrical appliances,etc
    UV glueControlled curing speed, environmentally friendlyCuring requires UV lamp equipment, difficult to peelMedical, electrical appliances, etc
    PolyurethaneWide range of materials, adjustable flexibility, low temperature resistancePoor heat resistance, not acid- resistance, easy to produce bubblesAutomotive, machinery, wood, etc
    Anaerobic adhesiveLow viscosity, fast curing at room temperature, easy to removeHighly demanding bonding surfaces, sensitive to temperature and pressureMechanical locking, leak-proof sealing, etc
    Silicone rubberResistance to oxidation and temperature changeSlightly lower bond strengthElectronics, electrical appliances, etc
    Table 1. Adhesive properties
    Bonding agentEpoxy glueSilicone rubber
    Bonding positionLong sideShort sideLong sideShort side
    Thickness/mm0.390.330.210.18
    Table 2. Calculation results of adhesive layer thickness
    No.Bottom adhesive and bonding area/mm2Side adhesive and bonding area/mm2
    1Epoxy glue/907.5 -
    2Epoxy glue/907.5Silicone rubber/598.3
    3Epoxy glue/907.5 Epoxy glue/598.3
    4Silicone rubber/907.5 Epoxy glue/598.3
    5Silicone rubber/907.5 Silicone rubber/598.3
    6Silicone rubber/907.5 Silicone rubber(dot-coated epoxy on top surface)/598.3
    Table 3. Binding scheme
    No.Output unitx/10−3 mmy/10−3 mmz/10−3 mms/10−3 mm$\overline{\Delta {s}} $/10−3 mm
    1−0.264 61.27050.08701.3011.0683
    0.268 41.19760.06931.229
    0.008 11.36120.12611.367
    0.132 20.7017−0.11450.723
    −0.087 60.71391−0.05610.721
    2−0.278 71.75540.17031.7851.4838
    0.281 61.65500.14811.685
    −0.016 31.91910.12011.923
    0.098 20.9942−0.01520.999
    −0.089 11.0231−0.01641.027
    3−0.30381.79400.19141.831.4966
    0.30231.69450.17631.73
    −0.01691.86990.09911.873
    −0.10921.0318−0.01161.038
    0.11751.0054−0.00841.012
    4−0.41861.54350.13821.6051.2717
    0.40991.44830.12311.51
    −0.02051.51310.04721.514
    −0.15030.8490−0.15420.876
    0.16160.8255−0.14600.854
    5−0.31241.48980.04291.5231.1877
    0.31261.41290.02211.447
    0.00881.46410.08211.466
    −0.08610.7345−0.19820.766
    0.10670.7038−0.19100.737
    6−0.30471.41970.38421.5021.1691
    0.31881.34320.34631.423
    0.04421.42980.31191.464
    −0.08740.72100.14290.740
    0.13630.69970.07220.716
    Table 4. Detector photosensitive surface output node displacement
    ParameterExperiment condition
    PressureAtmospheric
    Temperature−22 ℃/+42 ℃
    Time2 h
    Cycle times4.5
    ToleranceLow-temperature(T0+4)℃,High-temperature(T0−4)℃
    Rate of change (temperature)3-5 ℃/min
    Table 5. Temperature change experiment condition
    No.MarkerPre-test/mmPost-thermal cycling/mmPost-vibration/mm
    1L(0,0,0)(0,0,0)(0,0,0)
    R(−0.051,−30.457,−0.02)(−0.053,−30.456,−0.02)(−0.052,−30.455,−0.02)
    5L(0.107,−160.343,−0.11)(0.106,−160.336,−0.11)(0.106,−160.336,0.12)
    R(0.029,−190.801,−0.13)(0.028,−190.794,−0.13)(0.028,−190.796,−0.13)
    6L(−0.031,−80.411, 0.01)(−0.031,−80.407,0.01)(−0.03,−80.408,0.01)
    R(−0.007,−110.870,0)(−0.006,−110.865,0)(−0.006,−110.867,0)
    Table 6. Marking point test data before and after the test
    No.Post-thermal cyclingPost-vibration
    Flatness/mmParallelism change/mmFlatness/mmParallelism change/mm
    10.00430.00360.00050.0039
    500.00040.00030.0012
    60.00070.000100.0001
    Table 7. Detector coplanar accuracy detection data
    Jinhui LI, Yingbo ZHU, Shanshan CONG, Lei ZHANG. Research on bonding method of light detector assembly of space remote sensing camera[J]. Infrared and Laser Engineering, 2024, 53(6): 20240065
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